HP Z230 User Manual

CPU (processor) and CPU heatsink
CAUTION: Observe the following cautions when removing or replacing the heatsink.
— When removing the heatsink, loosen all screws a little at a time to make sure the CPU remains
level. Do
not fully loosen one screw, and then move on to the next.
— After you remove the CPU heatsink from the chassis, use alcohol and a soft cloth to clean the
thermal compound residue from the CPU and the heatsink, allowing the alcohol on the CPU and CPU
heatsink to dry completely.
— If you are reusing the original heatsink, apply thermal compound to the center of the CPU top
surface.
— If you are using a new CPU heatsink, do not apply thermal compound to the CPU because the
new heatsink already has thermal compound applied to the heatsink surface. Instead, remove the
thermal compound protective liner from the bottom of the new heatsink.
— Do not overtighten the heatsink screws. Overtightening can strip the threads in the chassis.
— Do not fully tighten one screw and then move on to the next. Instead, tighten all screws a little at a
time, ensuring that the CPU remains level.
CAUTION: Observe the following cautions when removing or replacing the CPU.
— If you are installing a second CPU, it must be of the same type as the first CPU.
— Internal components might be powered even when the computer is off. To prevent damage,
disconnect the computer power cord before you remove or install a component.
— The CPU socket contacts and pads are extremely fragile. Do not touch the CPU socket contacts or
the gold pads underneath the CPU. Use extreme care and handle the CPU only by the edges.
— The CPU socket contacts are delicate and bend easily. To avoid bending the contacts, use
extreme care when installing the CPU in the socket.
— Installing a processor incorrectly can damage the system board. Contact an HP authorized reseller
or service provider to install the processor. If you plan to install the processor yourself, view the entire
remove and replace video before you begin.
— Failure to follow the computer preparation instructions can result in an improperly installed
processor, causing extensive computer damage.
Component replacement guidelines 59

HP Z230 Specifications

General

Product type	Workstation
Motherboard chipset	Intel® C226
ECC	Yes
Memory slots	4x DIMM
Internal memory	4 GB
Memory channels	Dual-channel
Memory clock speed	1600 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	32 GB
Memory layout (slots x size)	1 x 4 GB
Chassis type	Desktop
Product color	Black
Country of origin	China
Placement supported	Vertical
Number of 3.5\" bays	1
Water cooling system	No
HDD speed	7200 RPM
RAID levels	0, 1
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Total storage capacity	500 GB
PS/2 ports quantity	2
DisplayPorts quantity	3
Serial ports quantity	-
USB 2.0 ports quantity	6
VGA (D-Sub) ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	4
Ethernet LAN data rates	10, 100, 1000 Mbit/s
On-board graphics card ID	0x412
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 4600
Maximum on-board graphics card memory	1.74 GB
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	11.1
On-board graphics card dynamic frequency (max)	1150 MHz
Power supply	240 W
Tcase	72.72 °C
Bus type	DMI2
Stepping	C0
Processor cache	6 MB
Processor model	i5-4570
System bus rate	5 GT/s
Processor family	Intel® Core™ i5
Processor socket	LGA 1150 (Socket H3)
Processor codename	Haswell
Processor frequency	3.2 GHz
Processor cache type	Smart Cache
Processor lithography	28 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.6 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	84 W
Maximum number of PCI Express lanes	16
Memory clock speeds supported by processor	1333, 1600 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Operating system installed	Windows 7 Professional
Scalability	1S
Processor code	SR14E
Processor ARK ID	75043
Intel TSX-NI version	0.00
Processor package size	37.5 x 37.5 mm
Graphics & IMC lithography	22 nm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Thermal solution specification	PCG 2013D
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	384 mm
Width	337 mm
Height	100 mm
Weight	7200 g