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HP Z230 User Manual

HP Z230
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Electrostatic discharge (ESD) information
Generating static Different activities generate different amounts of static electricity through electrostatic discharge
(ESD). Static electricity increases as humidity decreases.
CAUTION: Static electricity in the amount of 700 volts might degrade a product.
Event
Relative humidity
55% 40% 10%
Walking across carpet
Walking across vinyl floor
Motions of bench worker
7,500 V
3,000 V
400V
15,000 V
5,000 V
800 V
35,000 V
12,000 V
6,000 V
Removing bubble pack from PCB
Packing PCBs in foam-lined box
7,000 V
5,000 V
20,000 V
11,000 V
26,500 V
21,000 V
Preventing ESD
equipment damage
Many electronic components are sensitive to ESD. Circuitry design and structure determine the
degree of sensitivity. The following packaging and grounding precautions are necessary to
prevent damage to electronic components and accessories:
Transport products in static-safe containers such as tubes, bags, or boxes, to avoid hand
contact.
Protect electrostatic parts and assemblies with nonconductive or approved containers or
packaging.
Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations.
Place items on a grounded surface before removing them from containers.
Before handling or touching a sensitive component or assembly, ground yourself by
touching a grounded metal object.
Avoid contact with pins, leads, or circuitry.
Place reusable electrostatic-sensitive parts from assemblies in protective packaging or
nonconductive foam.
Personal grounding
methods and
equipment
Use the following items to help prevent ESD damage:
Wrist straps — These are flexible straps with a maximum of one megohm ± 10% resistance
in the ground cords. To provide a proper ground, wear the strap against bare skin. The
ground cord must be connected and fit snugly into the banana plug connector on the
grounding mat or computer.
Heel straps, toe straps, and boot straps — These can be used at standing computers and
are compatible with most types of shoes or boots. On conductive floors or dissipative floor
mats, use them on both feet with a maximum of one megohm ± 10% resistance between the
operator and ground.
Static shielding
materials
Static shielding materials provide the following levels of protection.
Method
Antistatic plastic
Carbon-loaded plastic
Metalized laminate
Voltage
1,500 V
7,500 V
15,000 V
Grounding the work
area to prevent static
damage
Cover the work surface with approved
static-dissipative material. Use a wrist
strap connected to the work surface, and
properly grounded tools and equipment.
Disconnect power and input signals before
inserting and removing connectors or test
equipment.
Service considerations 55

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HP Z230 Specifications

General IconGeneral
Product typeWorkstation
Motherboard chipsetIntel® C226
ECCYes
Memory slots4x DIMM
Internal memory4 GB
Memory channelsDual-channel
Memory clock speed1600 MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory32 GB
Memory layout (slots x size)1 x 4 GB
Chassis typeDesktop
Product colorBlack
Country of originChina
Placement supportedVertical
Number of 3.5\" bays1
Water cooling systemNo
HDD speed7200 RPM
RAID levels0, 1
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Total storage capacity500 GB
PS/2 ports quantity2
DisplayPorts quantity3
Serial ports quantity-
USB 2.0 ports quantity6
VGA (D-Sub) ports quantity0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity4
Ethernet LAN data rates10, 100, 1000 Mbit/s
On-board graphics card ID0x412
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 4600
Maximum on-board graphics card memory1.74 GB
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version11.1
On-board graphics card dynamic frequency (max)1150 MHz
Power supply240 W
Tcase72.72 °C
Bus typeDMI2
SteppingC0
Processor cache6 MB
Processor modeli5-4570
System bus rate5 GT/s
Processor familyIntel® Core™ i5
Processor socketLGA 1150 (Socket H3)
Processor codenameHaswell
Processor frequency3.2 GHz
Processor cache typeSmart Cache
Processor lithography28 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency3.6 GHz
Processor operating modes64-bit
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)84 W
Maximum number of PCI Express lanes16
Memory clock speeds supported by processor1333, 1600 MHz
Memory bandwidth supported by processor (max)25.6 GB/s
Operating system installedWindows 7 Professional
Scalability1S
Processor codeSR14E
Processor ARK ID75043
Intel TSX-NI version0.00
Processor package size37.5 x 37.5 mm
Graphics & IMC lithography22 nm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal solution specificationPCG 2013D
Intel Identity Protection Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Depth384 mm
Width337 mm
Height100 mm
Weight7200 g

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