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HP Z4 G4 User Manual

HP Z4 G4
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Preventing electrostatic damage to equipment
Many electronic components are sensitive to ESD. Circuitry design and structure determine the degree of
sensitivity. The following packaging and grounding precautions are necessary to prevent damage to electric
components and accessories.
To avoid hand contact, transport products in static-safe containers such as tubes, bags, or boxes.
Protect all electrostatic-sensitive parts and assemblies with conductive or approved containers
or packaging.
Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations.
Place items on a grounded surface before removing them from their containers.
Always be properly grounded when touching a sensitive component or assembly.
Avoid contact with pins, leads, or circuitry.
Place reusable electrostatic-sensitive parts from assemblies in protective packaging or
conductive foam.
Personal grounding methods and equipment
Use the following equipment to prevent static electricity damage to equipment:
Wrist straps are exible straps with a maximum of one-megohm ± 10% resistance in the ground cords.
To provide proper ground, a strap must be worn snugly against bare skin. The ground cord must be
connected to the banana plug connector on the grounding mat or workstation and t snugly into it.
Heel straps/Toe straps/Boot straps can be used at standing workstations and are compatible with
most types of shoes or boots. On conductive oors or dissipative oor mats, use them on both feet with
a maximum of one-megohm ± 10% resistance between the operator and ground.
Static Shielding Protection Levels
Method Voltage
Antistatic plastic
Carbon-loaded plastic
Metallized laminate
1,500
7,500
15,000
Grounding the work area
To prevent static damage at the work area, observe the following precautions:
Cover the work surface with approved static-dissipative material. Provide a wrist strap connected to
the work surface and use properly grounded tools and equipment.
Use static-dissipative mats, foot straps, or air ionizers to give added protection.
Handle electrostatic-sensitive components, parts, and assemblies by the case or PCB laminate. Handle
them only at static-free work areas.
Turn o power and input signals before inserting and removing connectors or test equipment.
Use xtures made of static-safe materials when xtures must directly contact dissipative surfaces.
Keep work area free of nonconductive materials such as ordinary plastic assembly aids and Styrofoam.
Use eld service tools, such as cutters, screwdrivers, and vacuums, that are conductive.
10 Chapter 3 Routine care, SATA drive guidelines, and disassembly preparation

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HP Z4 G4 Specifications

General IconGeneral
Tcase65 °C
Bus typeQPI
SteppingU0
Processor cache8.25 MB
Processor cores6
Processor modelW-2133
System bus rate0 GT/s
Processor socketLGA 2066 (Socket R4)
Processor threads12
Processor codenameSkylake
Processor frequency3.6 GHz
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3.9 GHz
Processor operating modes64-bit
ECC supported by processorYes
PCI Express configurations1x16, 1x4, 1x8
Thermal Design Power (TDP)140 W
Number of processors installed1
Maximum number of PCI Express lanes48
Memory types supported by processorDDR4-SDRAM
Memory clock speeds supported by processor1600, 1866, 2133, 2400, 2666 MHz
Memory bandwidth supported by processor (max)85.3 GB/s
Maximum internal memory supported by processor512 GB
Operating system installedWindows 10 Pro for Workstations
Memory slots8x DIMM
Internal memory16 GB
Memory channelsQuad-channel
Memory clock speed2666 MHz
Maximum internal memory256 GB
Memory layout (slots x size)2 x 8 GB
HDD speed7200 RPM
RAID levels0, 1, 5, 10
HDD capacity1000 GB
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
HDD interfaceSATA
SSD interfacePCI Express
Storage mediaHDD+SSD
Optical drive typeDVD-RW
Card reader integratedNo
Total storage capacity1256 GB
Discrete graphics card modelNot available
Power supply1000 W
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity10
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity0
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity2
Sustainability certificatesENERGY STAR
Chassis typeTower
Product colorBlack
Country of originChina
Intel® vPro™ Platform Eligibility-
Audio chipRealtek HD ALC221
Product typeWorkstation
Motherboard chipsetIntel® C422
Scalability1S
Processor codeSR3LL
Processor ARK ID125040
Processor package size45 x 52.5 mm
Supported instruction setsAVX, AVX 2.0, AVX-512, SSE4.2
Intel Identity Protection Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Depth445 mm
Width169 mm
Height386 mm
Weight10200 g

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