3. Caution for LEAD-FREE soldering work
For this equipment, parts compatible with lead-free materials are used. Please observe the following precautions,
when performing any soldering work.
1) Use lead-free solder for substrates mounted with lead-free parts. If you use eutectic solder by mistake, solder will
not fuse well because of the difference in fusion point.
2) Fusion Point
Lead-free solder: 220°C
Eutectic solder: 183°C
3) Solder composition of Lead-free solder: Sn-3.0Ag-0.5Cu
[Maker ] [Type]
Nihon Genma DHB-RMA NP303-###
Senju metal ESC F3 M705E-###
(#: This mark shows the diameter of the solder wire.)
4) When working with lead-free solder always use a temperature adjustable soldering iron. Moreover, the power
consumption of the soldering iron must use from 25W to 75W.
[Solder Iron tip temperature and contact time]
Category of Parts Lead-free solder Eutectic solder
*SMD Chip The Parts of Chip type 300-320°C(1-3sec) 260-280°C(1-3sec)
*SMD QFP The Parts (IC) of Quad Flat Pack Package type 320-350°C(1-3sec) 280-300°C(1-3sec)
Heat sink Heat sink 360-380°C(1-3sec) 320-420°C(1-3sec)
The Parts of Axial or Radial type
(The Electric Parts other than the above-mentioned.
Ax, RD
Ex.: IC, Transistor, Resistor, Capacitor)
340-370°C(1-3sec) 350-390°C(1-3sec)
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