Quectel LPWA Series User Manual

LPWA Module Series
BG950A-GL&BG951A-GL_Hardware_Design
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Table 48: Recommended Thermal Profile Parameters
1. If a conformal coating is necessary for the module, do NOT use any coating material that may
chemically react with the PCB or shielding cover, and prevent the coating material from flowing into
the module.
2. Avoid using ultrasonic technology for module cleaning since it can damage crystals inside the
module.
3. Due to the complexity of the SMT process, please contact Quectel Technical Supports in advance for
any situation that you are not sure about, or any process (e.g. selective soldering, ultrasonic
soldering) that is not mentioned in document [6].
9.3. Packaging Specifications
The module adopts carrier tape packaging and details are as follow:
9.3.1. Carrier Tape
Dimension details are as follow:
Factor
Recommendation
Soak Zone
Max slope
1–3 °C/s
Soak time (between A and B: 150 °C and 200 °C)
70–120 s
Reflow Zone
Max slope
2–3 °C/s
Reflow time (D: over 217 °C)
40–70 s
Max temperature
235–246 °C
Cooling down slope
-1.5 to 3 °C/s
Reflow Cycle
Max reflow cycle
1
NOTE

Quectel LPWA Series Specifications

General

Brand	Quectel
Model	LPWA Series
Category	GSM/GPRS Modules
Language	English