Sony SS-TSF500 User Manual

42
SA-WSF200/WSF500/SS-CTF500/F500/TSF200/TSF500
SECTION 6
ELECTRICAL PARTS LIST
A-1508-649-A AMP-DSP BOARD, COMPLETE
(SA-WSF200: AEP, UK)
A-1508-673-A AMP-DSP BOARD, COMPLETE
(SA-WSF200: SP, TH)
A-1508-692-A AMP-DSP BOARD, COMPLETE (SA-WSF500: RU)
A-1508-695-A AMP-DSP BOARD, COMPLETE
(SA-WSF500: CND)
A-1508-698-A AMP-DSP BOARD, COMPLETE
(SA-WSF500: SP, TW, TH)
A-1508-713-A AMP-DSP BOARD, COMPLETE (SA-WSF500: KR)
A-1508-716-A AMP-DSP BOARD, COMPLETE
(SA-WSF500: E3, E15, EA)
A-1508-719-A AMP-DSP BOARD, COMPLETE
(SA-WSF500: AUS)
A-1508-722-A AMP-DSP BOARD, COMPLETE
(SA-WSF500: E32)
A-1508-738-A AMP-DSP BOARD, COMPLETE (SA-WSF500: MX)
************************
< CAPACITOR >
C207 1-126-934-11 ELECT 220uF 20% 16V
C208 1-115-339-11 CERAMIC CHIP 0.1uF 10% 50V
C221 1-162-915-11 CERAMIC CHIP 10PF 0.5PF 50V
C222 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C223 1-126-933-11 ELECT 100uF 20% 16V
C224 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C225 1-165-908-11 CERAMIC CHIP 1uF 10% 10V
C226 1-162-970-11 CERAMIC CHIP 0.01uF 10% 25V
C227 1-126-923-91 ELECT 220uF 20% 10V
C228 1-162-964-11 CERAMIC CHIP 0.001uF 10% 50V
C229 1-162-910-11 CERAMIC CHIP 5PF 0.25PF 50V
C231 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C232 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C233 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C234 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C235 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C236 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C237 1-126-947-11 ELECT 47uF 20% 35V
C238 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C239 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C240 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C271 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C272 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C273 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C274 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C275 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C276 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C277 1-126-947-11 ELECT 47uF 20% 35V
C278 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C279 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C280 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V
C301 1-115-185-11 CERAMIC CHIP 0.033uF 10% 50V
C302 1-112-246-11 ELECT 100uF 20% 35V
C303 1-107-725-11 CERAMIC CHIP 0.1uF 10% 16V
C304 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C305 1-104-329-11 CERAMIC CHIP 0.1uF 10% 50V
C306 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C307 1-131-704-11 FILM 1uF 5% 50V
C308 1-107-725-11 CERAMIC CHIP 0.1uF 10% 16V
C309 1-131-704-11 FILM 1uF 5% 50V
C310 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C311 1-107-725-11 CERAMIC CHIP 0.1uF 10% 16V
C312 1-128-451-11 ELECT CHIP 22uF 20% 16V
C313 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C314 1-112-246-11 ELECT 100uF 20% 35V
C315 1-104-329-11 CERAMIC CHIP 0.1uF 10% 50V
C316 1-107-725-11 CERAMIC CHIP 0.1uF 10% 16V
C317 1-100-924-21 ELECT 2200uF 20% 35V
C318 1-115-185-11 CERAMIC CHIP 0.033uF 10% 50V
C321 1-115-185-11 CERAMIC CHIP 0.033uF 10% 50V
C322 1-112-246-11 ELECT 100uF 20% 35V
C323 1-107-725-11 CERAMIC CHIP 0.1uF 10% 16V
C324 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C325 1-104-329-11 CERAMIC CHIP 0.1uF 10% 50V
C326 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C327 1-131-704-11 FILM 1uF 5% 50V
C328 1-107-725-11 CERAMIC CHIP 0.1uF 10% 16V
C329 1-131-704-11 FILM 1uF 5% 50V
C330 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C331 1-107-725-11 CERAMIC CHIP 0.1uF 10% 16V
C332 1-128-451-11 ELECT CHIP 22uF 20% 16V
C333 1-162-966-11 CERAMIC CHIP 0.0022uF 10% 50V
C334 1-112-246-11 ELECT 100uF 20% 35V
C335 1-104-329-11 CERAMIC CHIP 0.1uF 10% 50V
C336 1-107-725-11 CERAMIC CHIP 0.1uF 10% 16V
C337 1-100-924-21 ELECT 2200uF 20% 35V
C338 1-115-185-11 CERAMIC CHIP 0.033uF 10% 50V
Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
AMP-DSP
When indicating parts by reference num-
ber, please include the board name.
Note:
• Due to standardization, replacements in
the parts list may be different from the
parts specifi ed in the diagrams or the com-
ponents used on the set.
• -XX and -X mean standardized parts, so
they may have some difference from the
original one.
• Items marked “*” are not stocked since
they are seldom required for routine ser-
vice. Some delay should be anticipated
when ordering these items.
• CAPACITORS
uF: µF
• COILS
uH: µH
• RESISTORS
All resistors are in ohms.
METAL: Metal-fi lm resistor.
METAL OXIDE: Metal oxide-fi lm resistor.
F: nonfl ammable
• SEMICONDUCTORS
In each case, u: µ, for example:
uA. . : µA. . , uPA. . , µPA. . ,
uPB. . : µPB. . , uPC. . , µPC. . ,
uPD. . : µPD. .
• Abbreviation
AUS : Australian model
CND : Canadian model
E3 : 240V AC area in E model
E15 : Iranian model
E32 : Latin American model
(110 – 240V AC area)
EA : Saudi Arabia model
KR : Korean model
The components identifi ed by mark 0
or dotted line with mark 0 are critical for
safety.
Replace only with part number specifi ed.
Les composants identifi és par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une pièce portant
le numéro spécifi é.
MX : Mexican model
RU : Russian model
SP : Singapore model
TH : Thai model
TW : Taiwan model
Note: Refer to the Servicing Notes “BOND FIXATION OF
ELECTRIC PARTS” (page 4) when you exchange
C307, C309, C317, C327, C329 and C337.
Ver. 1.1

Sony SS-TSF500 Specifications

General

Brand	Sony
Model	SS-TSF500
Category	Speaker System
Language	English