SARA-R5 series - System integration manual
UBX-19041356 - R04 Handling and soldering Page 102 of 118
C1-Public
3.3.11 Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips
directly onto the EMI covers is done at the customer's own risk. The numerous ground pins should be
sufficient to provide optimum immunity to interference and noise.
☞ u-blox gives no warranty for damages to the cellular modules caused by soldering metal cables or
any other forms of metal strips directly onto the EMI covers.
3.3.12 Use of ultrasonic processes
The cellular modules contain components which are sensitive to ultrasonic waves. Use of any
ultrasonic processes (cleaning, welding etc.) may cause damage to the module.
☞ u-blox gives no warranty for damages to the cellular modules caused by any ultrasonic processes.
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