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HP Elite x2 1011 G1 Maintenance And Service Guide

HP Elite x2 1011 G1
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4 Removal and replacement preliminary
requirements
Tools required
You will need the following tools to complete the removal and replacement procedures:
Flat-bladed screw driver
Magnetic screw driver
Phillips P0 screw driver
Service considerations
The following sections include some of the considerations that you must keep in mind during disassembly
and assembly procedures.
NOTE: As you remove each subassembly from the slate, place the subassembly (and all accompanying
screws) away from the work area to prevent damage.
Plastic parts
CAUTION: Using excessive force during disassembly and reassembly can damage plastic parts. Use care
when handling the plastic parts. Apply pressure only at the points designated in the
maintenance instructions.
Cables and connectors
CAUTION: When servicing the slate, be sure that cables are placed in their proper locations during the
reassembly process. Improper cable placement can damage the slate.
Cables must be handled with extreme care to avoid damage. Apply only the tension required to unseat or
seat the cables during removal and insertion. Handle cables by the connector whenever possible. In all cases,
avoid bending, twisting, or tearing cables. Be sure that cables are routed in such a way that they cannot be
caught or snagged by parts being removed or replaced. Handle flex cables with extreme care; these cables
tear easily.
30 Chapter 4 Removal and replacement preliminary requirements

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HP Elite x2 1011 G1 Specifications

General IconGeneral
SteppingF0
Tjunction95 °C
Processor codeSR23L
Processor cache4 MB
Processor cores2
System bus rate- GT/s
Processor familyIntel® Core™ M
Processor seriesIntel Core M-5Y Mobile series
Processor threads4
Processor codenameBroadwell
Processor frequency1.1 GHz
Processor cache typeL3
Processor manufacturerIntel
Processor package size30 x 16.5 mm
Conflict-Free processorYes
Processor front side bus- MHz
Processor boost frequency2.6 GHz
Processor operating modes32-bit, 64-bit
Graphics & IMC lithography14 nm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)4.5 W
Scenario Design Power (SDP)3.5 W
Configurable TDP-down frequency0.6 GHz
Internal memory8 GB
Memory clock speed1600 MHz
Internal memory typeDDR3L-SDRAM
Storage mediaSSD
Compatible memory cardsMicroSD (TransFlash)
Internal storage capacity256 GB
Display diagonal11.6 \
Touch technologyMulti-touch
Graphics cardHD Graphics 5300
Rear camera typeSingle camera
Rear camera resolution (numeric)5 MP
Front camera resolution (numeric)2 MP
Processor ARK ID84669
Processor socketBGA 1234
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.0
Top Wi-Fi standardWi-Fi 5 (802.11ac)
Near Field Communication (NFC)-
Microphone inNo
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Country of originChina
Device typeTablet PC
Form factorSlate
Product colorBlack, Silver
Intel Identity Protection Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Battery capacity- mAh
Battery life (max)9 h
PlatformWindows
Operating system installedWindows 8.1 Pro
Weight and Dimensions IconWeight and Dimensions
Depth192.7 mm
Width298 mm
Height10.7 mm
Weight780 g

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