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HP Elite x2 1011 G1 Maintenance And Service Guide

HP Elite x2 1011 G1
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Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure
determine the degree of sensitivity. Networks built into many integrated circuits provide some protection,
but in many cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a finger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be affected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life
expectancy.
CAUTION: To prevent damage to the slate when you are removing or installing internal components,
observe these precautions:
Keep components in their electrostatic-safe containers until you are ready to install them.
Before touching an electronic component, discharge static electricity by using the guidelines described in this
section.
Avoid touching pins, leads, and circuitry. Handle electronic components as little as possible.
If you remove a component, place it in an electrostatic-safe container.
The following table shows how humidity affects the electrostatic voltage levels generated by
different activities.
CAUTION: A product can be degraded by as little as 700 V.
Typical electrostatic voltage levels
Relative humidity
Event 10% 40% 55%
Walking across carpet 35,000 V 15,000 V 7,500 V
Walking across vinyl floor 12,000 V 5,000 V 3,000 V
Motions of bench worker 6,000 V 800 V 400 V
Removing DIPS from plastic tube 2,000 V 700 V 400 V
Removing DIPS from vinyl tray 11,500 V 4,000 V 2,000 V
Removing DIPS from Styrofoam 14,500 V 5,000 V 3,500 V
Removing bubble pack from PCB 26,500 V 20,000 V 7,000 V
Packing PCBs in foam-lined box 21,000 V 11,000 V 5,000 V
Grounding guidelines 31

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HP Elite x2 1011 G1 Specifications

General IconGeneral
SteppingF0
Tjunction95 °C
Processor codeSR23L
Processor cache4 MB
Processor cores2
System bus rate- GT/s
Processor familyIntel® Core™ M
Processor seriesIntel Core M-5Y Mobile series
Processor threads4
Processor codenameBroadwell
Processor frequency1.1 GHz
Processor cache typeL3
Processor manufacturerIntel
Processor package size30 x 16.5 mm
Conflict-Free processorYes
Processor front side bus- MHz
Processor boost frequency2.6 GHz
Processor operating modes32-bit, 64-bit
Graphics & IMC lithography14 nm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)4.5 W
Scenario Design Power (SDP)3.5 W
Configurable TDP-down frequency0.6 GHz
Internal memory8 GB
Memory clock speed1600 MHz
Internal memory typeDDR3L-SDRAM
Storage mediaSSD
Compatible memory cardsMicroSD (TransFlash)
Internal storage capacity256 GB
Display diagonal11.6 \
Touch technologyMulti-touch
Graphics cardHD Graphics 5300
Rear camera typeSingle camera
Rear camera resolution (numeric)5 MP
Front camera resolution (numeric)2 MP
Processor ARK ID84669
Processor socketBGA 1234
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.0
Top Wi-Fi standardWi-Fi 5 (802.11ac)
Near Field Communication (NFC)-
Microphone inNo
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Country of originChina
Device typeTablet PC
Form factorSlate
Product colorBlack, Silver
Intel Identity Protection Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Battery capacity- mAh
Battery life (max)9 h
PlatformWindows
Operating system installedWindows 8.1 Pro
Weight and Dimensions IconWeight and Dimensions
Depth192.7 mm
Width298 mm
Height10.7 mm
Weight780 g

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