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HP Elite x2 1011 G1 Maintenance And Service Guide

HP Elite x2 1011 G1
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and
equipment.
Use conductive field service tools, such as cutters, screw drivers, and vacuums.
When fixtures must directly contact dissipative surfaces, use fixtures made only of static-
safe materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids
and Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn off power and input signals before inserting or removing connectors or test equipment.
32 Chapter 4 Removal and replacement preliminary requirements

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HP Elite x2 1011 G1 Specifications

General IconGeneral
SteppingF0
Tjunction95 °C
Processor codeSR23L
Processor cache4 MB
Processor cores2
System bus rate- GT/s
Processor familyIntel® Core™ M
Processor seriesIntel Core M-5Y Mobile series
Processor threads4
Processor codenameBroadwell
Processor frequency1.1 GHz
Processor cache typeL3
Processor manufacturerIntel
Processor package size30 x 16.5 mm
Conflict-Free processorYes
Processor front side bus- MHz
Processor boost frequency2.6 GHz
Processor operating modes32-bit, 64-bit
Graphics & IMC lithography14 nm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Thermal Design Power (TDP)4.5 W
Scenario Design Power (SDP)3.5 W
Configurable TDP-down frequency0.6 GHz
Internal memory8 GB
Memory clock speed1600 MHz
Internal memory typeDDR3L-SDRAM
Storage mediaSSD
Compatible memory cardsMicroSD (TransFlash)
Internal storage capacity256 GB
Display diagonal11.6 \
Touch technologyMulti-touch
Graphics cardHD Graphics 5300
Rear camera typeSingle camera
Rear camera resolution (numeric)5 MP
Front camera resolution (numeric)2 MP
Processor ARK ID84669
Processor socketBGA 1234
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.0
Top Wi-Fi standardWi-Fi 5 (802.11ac)
Near Field Communication (NFC)-
Microphone inNo
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Country of originChina
Device typeTablet PC
Form factorSlate
Product colorBlack, Silver
Intel Identity Protection Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Battery capacity- mAh
Battery life (max)9 h
PlatformWindows
Operating system installedWindows 8.1 Pro
Weight and Dimensions IconWeight and Dimensions
Depth192.7 mm
Width298 mm
Height10.7 mm
Weight780 g

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