Acronyms and abbreviations
3DS TSV
Three-dimensional stacked through-silicon via (integrated circuit packaging technology)
API
application program interface
CAS
column address strobe
CSR
Customer Self Repair
DDR4
double data rate-4
EAC
EurAsian Conformity
fsx
file system exerciser
HPE RSS
HPE Rapid Setup Software
HPE SSA
HPE Smart Storage Administrator
ISO
International Organization for Standardization
LFF
Large form factor
LRDIMM
load reduced dual in-line memory module
PCIe
Peripheral Component Interconnect Express
PDU
power distribution unit
POST
Power-On Self-Test
PSU
power supply unit
RDIMM
registered dual in-line memory module
Acronyms and abbreviations
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