HP zbook 15 G3 User Manual

Cables and connectors
CAUTION: When servicing the computer, be sure that cables are placed in their proper locations during the
reassembly process. Improper cable placement can damage the computer.
Cables must be handled with extreme care to avoid damage. Apply only the tension required to unseat or seat
the cables during removal and insertion. Handle cables by the connector whenever possible. In all cases, avoid
bending, twisting, or tearing cables. Be sure that cables are routed in such a way that they cannot be caught
or snagged by parts being removed or replaced. Handle ex cables with extreme care; these cables tear
easily.
Drive handling
CAUTION: Drives are fragile components that must be handled with care. To prevent damage to
the computer, damage to a drive, or loss of information, observe these precautions:
Before removing or inserting a hard drive, shut down the computer. If you are unsure whether the computer is
o or in Hibernation, turn the computer on, and then shut it down through the operating system.
Before handling a drive, be sure that you are discharged of static electricity. While handling a drive, avoid
touching the connector.
Before removing a diskette drive or optical drive, be sure that a diskette or disc is not in the drive and be sure
that the optical drive tray is closed.
Handle drives on surfaces covered with at least one inch of shock-proof foam.
Avoid dropping drives from any height onto any surface.
After removing a hard drive, an optical drive, or a diskette drive, place it in a static-proof bag.
Avoid exposing an internal hard drive to products that have magnetic elds, such as monitors or speakers.
Avoid exposing a drive to temperature extremes or liquids.
If a drive must be mailed, place the drive in a bubble pack mailer or other suitable form of protective
packaging and label the package “FRAGILE.”
Grounding guidelines
Electrostatic discharge damage
Electronic components are sensitive to electrostatic discharge (ESD). Circuitry design and structure determine
the degree of sensitivity. Networks built into many integrated circuits provide some protection, but in many
cases, ESD contains enough power to alter device parameters or melt silicon junctions.
A discharge of static electricity from a nger or other conductor can destroy static-sensitive devices or
microcircuitry. Even if the spark is neither felt nor heard, damage may have occurred.
An electronic device exposed to ESD may not be aected at all and can work perfectly throughout a normal
cycle. Or the device may function normally for a while, then degrade in the internal layers, reducing its life
expectancy.
Grounding guidelines 25

HP zbook 15 G3 Specifications

General

Form factor	Clamshell
Product type	Mobile workstation
Product color	Black
Cable lock slot	Yes
Country of origin	China
Bus type	DMI3
Stepping	R0
Tjunction	100 °C
Processor cache	6 MB
Processor cores	4
Processor model	i7-6700HQ
System bus rate	8 GT/s
Processor family	Intel® Core™ i7
Processor series	Intel Core i7-6700 Mobile series
Processor socket	BGA 1440
Processor threads	8
Processor codename	Skylake
Processor frequency	2.6 GHz
Processor cache type	Smart Cache
Configurable TDP-down	35 W
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	45 W
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, LPDDR3-SDRAM, DDR4-SDRAM
Memory clock speeds supported by processor	1866, 2133, 1600 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	64 GB
Motherboard chipset	Intel CM236
Pointing device	Touchpad
Recovery operating system	Windows 10 Pro
Operating system installed	Windows 7 Professional
Memory slots	4x SO-DIMM
Internal memory	8 GB
Memory channels	Dual-channel
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	2 x 4 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	PCI Express
Storage media	SSD
Total storage capacity	256 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
Display diagonal	15.6 \
Native aspect ratio	16:9
On-board graphics card ID	0x191B
Discrete graphics card model	NVIDIA® Quadro® M2000M
On-board graphics card model	Intel® HD Graphics 530
Discrete graphics card memory	4 GB
Discrete graphics memory type	GDDR5
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.7 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Battery capacity	90 Wh
Number of battery cells	9
AC adapter power	150 W
Number of built-in speakers	2
Wi-Fi standards	802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.0
Top Wi-Fi standard	Wi-Fi 5 (802.11ac)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
HDMI version	1.4
USB 2.0 ports quantity	0
Sustainability certificates	ENERGY STAR
Processor code	SR2FQ
Processor ARK ID	88967
Processor package size	42 x 28 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Intel Smart Response Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	264 mm
Width	386 mm
Height	26 mm
Weight	2590 g