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HP zbook 15 G3 User Manual

HP zbook 15 G3
202 pages
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Packaging and transporting guidelines
Follow these grounding guidelines when packaging and transporting equipment:
To avoid hand contact, transport products in static-safe tubes, bags, or boxes.
Protect ESD-sensitive parts and assemblies with conductive or approved containers or packaging.
Keep ESD-sensitive parts in their containers until the parts arrive at static-free workstations.
Place items on a grounded surface before removing items from their containers.
Always be properly grounded when touching a component or assembly.
Store reusable ESD-sensitive parts from assemblies in protective packaging or nonconductive foam.
Use transporters and conveyors made of antistatic belts and roller bushings. Be sure that mechanized
equipment used for moving materials is wired to ground and that proper materials are selected to avoid
static charging. When grounding is not possible, use an ionizer to dissipate electric charges.
Workstation guidelines
Follow these grounding workstation guidelines:
Cover the workstation with approved static-shielding material.
Use a wrist strap connected to a properly grounded work surface and use properly grounded tools and
equipment.
Use conductive eld service tools, such as cutters, screw drivers, and vacuums.
When xtures must directly contact dissipative surfaces, use xtures made only of static-safe materials.
Keep the work area free of nonconductive materials, such as ordinary plastic assembly aids
and Styrofoam.
Handle ESD-sensitive components, parts, and assemblies by the case or PCM laminate. Handle these
items only at static-free workstations.
Avoid contact with pins, leads, or circuitry.
Turn o power and input signals before inserting or removing connectors or test equipment.
Grounding guidelines 27

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HP zbook 15 G3 Specifications

General IconGeneral
Form factorClamshell
Product typeMobile workstation
Product colorBlack
Cable lock slotYes
Country of originChina
Bus typeDMI3
SteppingR0
Tjunction100 °C
Processor cache6 MB
Processor cores4
Processor modeli7-6700HQ
System bus rate8 GT/s
Processor familyIntel® Core™ i7
Processor seriesIntel Core i7-6700 Mobile series
Processor socketBGA 1440
Processor threads8
Processor codenameSkylake
Processor frequency2.6 GHz
Processor cache typeSmart Cache
Configurable TDP-down35 W
Processor lithography14 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version3.0
Processor boost frequency3.5 GHz
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)45 W
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3L-SDRAM, LPDDR3-SDRAM, DDR4-SDRAM
Memory clock speeds supported by processor1866, 2133, 1600 MHz
Memory bandwidth supported by processor (max)34.1 GB/s
Maximum internal memory supported by processor64 GB
Motherboard chipsetIntel CM236
Pointing deviceTouchpad
Recovery operating systemWindows 10 Pro
Operating system installedWindows 7 Professional
Memory slots4x SO-DIMM
Internal memory8 GB
Memory channelsDual-channel
Memory clock speed2133 MHz
Internal memory typeDDR4-SDRAM
Memory layout (slots x size)2 x 4 GB
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
SSD interfacePCI Express
Storage mediaSSD
Total storage capacity256 GB
Compatible memory cardsSD, SDHC, SDXC
Number of SSDs installed1
Display diagonal15.6 \
Native aspect ratio16:9
On-board graphics card ID0x191B
Discrete graphics card modelNVIDIA® Quadro® M2000M
On-board graphics card modelIntel® HD Graphics 530
Discrete graphics card memory4 GB
Discrete graphics memory typeGDDR5
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1.7 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency350 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1050 MHz
Number of displays supported (on-board graphics)3
Battery capacity90 Wh
Number of battery cells9
AC adapter power150 W
Number of built-in speakers2
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.0
Top Wi-Fi standardWi-Fi 5 (802.11ac)
Ethernet LAN data rates10, 100, 1000 Mbit/s
HDMI version1.4
USB 2.0 ports quantity0
Sustainability certificatesENERGY STAR
Processor codeSR2FQ
Processor ARK ID88967
Processor package size42 x 28 mm
Supported instruction setsSSE4.1, SSE4.2, AVX 2.0
Intel Smart Response Technology version1.00
Intel Stable Image Platform Program (SIPP) version0.00
Weight and Dimensions IconWeight and Dimensions
Depth264 mm
Width386 mm
Height26 mm
Weight2590 g

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