HP zbook 15 G3 User Manual

Heat sink assembly
NOTE: Only remove the heat sink from the system board if its removal is required to remove other
components. It is preferred to leave the heat sink connected to the system board when possible to preserve
the thermal materials used between the heat sink and system board. Removal of the heat sink requires
reapplication of this thermal material.
NOTE: The heat sink assembly spare part kit includes replacement thermal material.
Description Spare part number
Heat sink for use only in models with Nvidia Quadro graphics boards 850148-001
Heat sink for use only in models with the AMD FirePro graphics board 850149-001
Heat sink for use only in models with UMA graphics memory 850150-001
Before removing the heat sink assembly, follow these steps:
1. Turn o the computer. If you are unsure whether the computer is o or in Hibernation, turn the
computer on, and then shut it down through the operating system.
2. Disconnect the power from the computer by unplugging the power cord from the computer.
3. Disconnect all external devices from the computer.
4. Remove the bottom cover (see Bottom cover on page 29).
5. Disconnect the battery (see Battery on page 31).
Remove the heat sink assembly:
1. On models with discrete graphics memory:
a. Following the (1) through (4) sequence stamped into the processor heat sink, loosen the four
Phillips captive screws that secure the processor heat sink to the system board.
b. Following the (5) through (8) sequence stamped into the graphics board heat sink, loosen the four
Phillips captive screws that secure the graphics board heat sink to the system board.
58 Chapter 6 Removal and replacement procedures for Authorized Service Provider parts

HP zbook 15 G3 Specifications

General

Form factor	Clamshell
Product type	Mobile workstation
Product color	Black
Cable lock slot	Yes
Country of origin	China
Bus type	DMI3
Stepping	R0
Tjunction	100 °C
Processor cache	6 MB
Processor cores	4
Processor model	i7-6700HQ
System bus rate	8 GT/s
Processor family	Intel® Core™ i7
Processor series	Intel Core i7-6700 Mobile series
Processor socket	BGA 1440
Processor threads	8
Processor codename	Skylake
Processor frequency	2.6 GHz
Processor cache type	Smart Cache
Configurable TDP-down	35 W
Processor lithography	14 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.5 GHz
Processor operating modes	64-bit
ECC supported by processor	No
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	45 W
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, LPDDR3-SDRAM, DDR4-SDRAM
Memory clock speeds supported by processor	1866, 2133, 1600 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	64 GB
Motherboard chipset	Intel CM236
Pointing device	Touchpad
Recovery operating system	Windows 10 Pro
Operating system installed	Windows 7 Professional
Memory slots	4x SO-DIMM
Internal memory	8 GB
Memory channels	Dual-channel
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Memory layout (slots x size)	2 x 4 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
SSD interface	PCI Express
Storage media	SSD
Total storage capacity	256 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
Display diagonal	15.6 \
Native aspect ratio	16:9
On-board graphics card ID	0x191B
Discrete graphics card model	NVIDIA® Quadro® M2000M
On-board graphics card model	Intel® HD Graphics 530
Discrete graphics card memory	4 GB
Discrete graphics memory type	GDDR5
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.7 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1050 MHz
Number of displays supported (on-board graphics)	3
Battery capacity	90 Wh
Number of battery cells	9
AC adapter power	150 W
Number of built-in speakers	2
Wi-Fi standards	802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.0
Top Wi-Fi standard	Wi-Fi 5 (802.11ac)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
HDMI version	1.4
USB 2.0 ports quantity	0
Sustainability certificates	ENERGY STAR
Processor code	SR2FQ
Processor ARK ID	88967
Processor package size	42 x 28 mm
Supported instruction sets	SSE4.1, SSE4.2, AVX 2.0
Intel Smart Response Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	264 mm
Width	386 mm
Height	26 mm
Weight	2590 g