Package Mechanical Specifications
36 Datasheet
3.5 Package Insertion Specifications
The processor can be inserted into and removed from a LGA775 socket 15 times. The
socket should meet the LGA775 requirements detailed in the LGA775 Socket
Mechanical Design Guide.
3.6 Processor Mass Specification
The typical mass of the processor is 21.5 g [0.76 oz]. This mass [weight] includes all
the components that are included in the package.
3.7 Processor Materials
Table 22 lists some of the package components and associated materials.
3.8 Processor Markings
Figure 10 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Table 22. Processor Materials
Component Material
Integrated Heat Spreader
(IHS)
Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 10. Processor Top-Side Markings Example for 1066 MHz Processors
ATPO
S/N
INTEL ©'05 QX6700
INTEL® CORE™2 EXTREME
SLxxx [COO]
2.66GHZ/8M/1066/05B
[FPO]
M
e4
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