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Case Temperature Reference Metrology

106 Thermal and Mechanical Design Guidelines

36. Clean the surface of the IHS with Alcohol and use compressed air to remove any

remaining contaminants.

37. Fill the rest of the groove with Loctite* 498 Adhesive. Verify under the microscope

that the thermocouple wire is below the surface along the entire length of the IHS

groove (see Figure 7-33).

Figure 7-33. Filling Groove with Adhesive

38. To speed up the curing process apply Loctite* Accelerator on top of the Adhesive

and let it set for a couple of minutes (see Figure 7-34).

Figure 7-34. Application of Accelerant

Table of Contents3
Revision History9
Introduction11
Document Goals and Scope11
- Importance of Thermal Management11
- Document Goals11
- Document Scope12
References13
Definition of Terms13
Processor Thermal/Mechanical Information15
Mechanical Requirements15
- Processor Package15
- Figure 2-1. Package IHS Load Areas15
- Heatsink Attach17
Thermal Requirements18
- Processor Case Temperature18
- Thermal Profile19
- Figure 2-2. Processor Case Temperature Measurement Location19
- Tcontrol20
- Figure 2-3. Example Thermal Profile20
Heatsink Design Considerations21
- Heatsink Size22
- Heatsink Mass22
- Package IHS Flatness23
- Thermal Interface Material23
System Thermal Solution Considerations24
- Chassis Thermal Design Capabilities24
- Improving Chassis Thermal Performance24
- Table 2-1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions24
- Table 2-2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions24
- Summary25
System Integration Considerations25
Thermal Metrology27
Characterizing Cooling Performance Requirements27
- Example28
- Figure 3-1. Processor Thermal Characterization Parameter Relationships28
Processor Thermal Solution Performance Assessment29
Local Ambient Temperature Measurement Guidelines29
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink31
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink31
Processor Case Temperature Measurement Guidelines32
Thermal Management Logic and Thermal Monitor Feature33
Processor Power Dissipation33
Thermal Monitor Implementation33
- PROCHOT# Signal34
- Thermal Control Circuit34
- Thermal Monitor 235
- Figure 4-1. Thermal Monitor Control35
- Operation and Configuration36
- Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering36
- On-Demand Mode37
- System Considerations37
- Operating System and Application Software Considerations38
- THERMTRIP# Signal38
- Cooling System Failure Warning38
  - Digital Thermal Sensor38
  - Platform Environmental Control Interface (PECI)39
  - Figure 4-3. TCONTROL for Digital Thermal Sensor39
- Balanced Technology Extended (BTX) Thermal/Mechanical Design Information41
- Overview of the Balanced Technology Extended (BTX) Reference Design41
  - Target Heatsink Performance41
  - Acoustics42
  - Table 5-1. Balanced Technology Extended (BTX) Type II Reference TMA Performance42
  - Table 5-2. Acoustic Targets43
  - Effective Fan Curve44
  - Voltage Regulator Thermal Management45
  - Figure 5-1. Effective TMA Fan Curves with Reference Extrusion45
  - Altitude46
  - Reference Heatsink Thermal Validation46
- Environmental Reliability Testing46
  - Structural Reliability Testing46
  - Table 5-3. VR Airflow Requirements46
  - Figure 5-2. Random Vibration PSD47
  - Figure 5-3. Shock Acceleration Curve48
  - Power Cycling49
  - Recommended Bios/Cpu/Memory Test Procedures49
- Material and Recycling Requirements49
- Safety Requirements50
- Geometric Envelope for Intel Reference BTX Thermal Module Assembly50
- Figure 5-4. Intel Type II TMA 65 W Reference Design50
- Preload and TMA Stiffness51
  - Structural Design Strategy51
  - TMA Preload Versus Stiffness51
  - Figure 5-5. Upward Board Deflection During Shock51
  - Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly Stiffness52
  - Table 5-4. Processor Preload Limits52
  - Figure 5-7. Thermal Module Attach Pointes and Duct-To-SRM Interface Features53
- ATX Thermal/Mechanical Design Information55
- ATX Reference Design Requirements55
- Figure 6-1. D60188-001Reference Design - Exploded View56
- Figure 6-2. E18764-001 Reference Design - Exploded View57
- Figure 6-3. Bottom View of Copper Core Applied by TC-1996 Grease57
- Validation Results for Reference Design58
  - Heatsink Performance58
  - Table 6-1. D60188-001 Reference Heatsink Performance58
  - Table 6-2. E18764-001 Reference Heatsink Performance58
  - Acoustics59
  - Table 6-3. Acoustic Results for ATX Reference Heatsink (D60188-001)59
  - Table 6-4. Acoustic Results for ATX Reference Heatsink (E18764-001)59
  - Altitude60
  - Heatsink Thermal Validation60
- Environmental Reliability Testing61
  - Structural Reliability Testing61
  - Figure 6-4. Random Vibration PSD61
  - Figure 6-5. Shock Acceleration Curve62
  - Power Cycling63
  - Recommended Bios/Cpu/Memory Test Procedures63
- Material and Recycling Requirements63
- Safety Requirements64
- Geometric Envelope for Intel Reference ATX Thermal Mechanical Design64
- Reference Attach Mechanism65
  - Structural Design Strategy65
  - Figure 6-6. Upward Board Deflection During Shock65
  - Mechanical Interface to the Reference Attach Mechanism66
  - Figure 6-7. Reference Clip/Heatsink Assembly66
  - Figure 6-8. Critical Parameters for Interfacing to Reference Clip67
  - Figure 6-9. Critical Core Dimension67
- Intel Quiet System Technology (Intel QST)69
- Intel QST Algorithm69
  - Output Weighting Matrix70
  - Proportional-Integral-Derivative (PID)70
  - Figure 7-1. Intel70
  - Figure 7-2. PID Controller Fundamentals71
- Board and System Implementation of Intel ® QST72
- Figure 7-3. Intel QST Platform Requirements72
- Figure 7-4. Example Acoustic Fan Speed Control Implementation73
- Intel ® QST Configuration and Tuning74
- Fan Hub Thermistor and Intel ® QST74
- Figure 7-5. Digital Thermal Sensor and Thermistor74
Appendix Alga775 Socket Heatsink Loading75
- LGA775 Socket Heatsink Considerations75
- Metric for Heatsink Preload for Atx/Uatx Designs Non-Compliant with Intel Reference Design75
- Heatsink Selection Guidelines80
Appendix B Heatsink Clip Load Metrology81
- Overview81
- Test Preparation81
- Test Procedure Examples84
Appendix C Thermal Interface Management87
- Bond Line Management87
- Interface Material Area87
- Interface Material Performance87
Appendix D Case Temperature Reference Metrology89
- Objective and Scope89
- Supporting Test Equipment89
- Figure 7-11. Omega Thermocouple90
- Thermal Calibration and Controls91
- IHS Groove91
- D.4 IHS Groove91
- Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 O'clock Exit92
- Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 O'clock Exit (Old Drawing)93
- Figure 7-14. IHS Groove at 6 O'clock Exit on the 775-LAND LGA Package94
- Figure 7-15. IHS Groove at 6 O'clock Exit Orientation Relative to the LGA775 Socket94
- Thermocouple Attach Procedure95
- Thermocouple Wire Management108
- Figure 7-37. Thermocouple Wire Management108
Appendix E Legacy Fan Speed Control109
- Thermal Solution Design109
- Board and System Implementation111
- Combining Thermistor and On-Die Thermal Sensor Control115
- Interaction of Thermal Profile and T115
- Figure 7-43. On-Die Thermal Sensor and Thermistor115
- Table 7-3. FSC Definitions116
- Figure 7-44. FSC Definition Example117
- Table 7-4. ATX FSC Settings118
- Table 7-5. Balanced Technology Extended (BTX) Fan Speed Control Settings119
Appendix F Balanced Technology Extended (BTX) System Thermal Considerations121
Figure 7-45. System Airflow Illustration with System Monitor Point Area Identified122
Figure 7-46. Thermal Sensor Location Illustration123
Table 7-6. Fan Electrical Performance Requirements125
Appendix G Fan Performance for Reference Design125
Figure 7-47. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height128
Figure 7-48. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height128
Figure 7-49. Atx/Μatx Motherboard Keep-Out Footprint Definition and Height128
Figure 7-61. Intel D60188-001 Reference Solution Assembly128
Figure 7-62. Intel D60188-001 Reference Solution Heatsink128
Figure 7-63. Intel E18764-001 Reference Solution Assembly128
Appendix Hmechanical Drawings128
- Reference Design146
- Table 7-7. Intel ® Representative Contact for Licensing Information of BTX146
- Table 7-8. D60188-001 Reference Thermal Solution Providers146
- Table 7-9. E18764-001 Reference Thermal Solution Providers147
- Table 7-10. Balanced Technology Extended (BTX) Reference Thermal Solution Providers148
Appendix I Intel Enabled Reference Solution Information146

Brand	Intel
Model	E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU
Category	Computer Hardware
Language	English

Intel E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU User Manual

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