Intel E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU User Manual

Introduction
Thermal and Mechanical Design Guidelines 13
1.2 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Document Location
Intel
®
Core™2 Extreme Processor X6800 and Intel
®
Core™2 Duo
Desktop Processor E6000 and E4000 Series Datasheet
http://intel.com
/design/processor/datashts/3132
78.htm
Intel
®
Pentium
®
Dual-Core Desktop Processor E2000 Series
Datasheet
www.intel.com//design/processor
/datashts/316981.htm
Intel
®
Celeron
®
Dual-Core Processor E1000 Series Datasheet http://www.intel.com/design/pro
cessor/datashts/318924.htm
LGA775 Socket Mechanical Design Guide http://intel.com/design/
Pentium4/guides/ 302666.htm
uATX SFF Design Guidance http://www.formfactors.org/
Fan Specification for 4-wire PWM Controlled Fans http://www.formfactors.org/
ATX Thermal Design Suggestions http://www.formfactors.org/
microATX Thermal Design Suggestions http://www.formfactors.org/
Balanced Technology Extended (BTX) System Design Guide http://www.formfactors.org/
Thermally Advantaged Chassis version 1.1 http://www.intel.com/go/chassis/
1.3 Definition of Terms
Term Description
T
A
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
T
C
The case temperature of the processor, measured at the geometric center of the topside
of the IHS.
T
E
The ambient air temperature external to a system chassis. This temperature is usually
measured at the chassis air inlets.
T
S
Heatsink temperature measured on the underside of the heatsink base, at a location
corresponding to T
C
.
T
C-MAX
The maximum case temperature as specified in a component specification.
CA
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (T
C
– T
A
) / Total Package
Power.
Note: Heat source must be specified for measurements.
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as
(T
C
– T
S
) / Total Package Power.
Note: Heat source must be specified for measurements.

Intel E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU Specifications

General

Brand	Intel
Model	E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU
Category	Computer Hardware
Language	English