Intel E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU User Manual

Legacy Fan Speed Control
110 Thermal and Mechanical Design Guidelines
The benefit of this upper limit will become more apparent when the fan speed
controller is responding to the on-die thermal sensor.
Figure
7-38. Thermistor Set Points
Fan Inlet
Temperature (°C)
Full
Speed
30
38
Min.
Operating
Variable Speed Fan (VSF) Curve
Fan Inlet
Temperature (°C)
Full
Speed
30
38
Min.
Operating
Variable Speed Fan (VSF) Curve
E.1.2 Minimum Fan Speed Set Point
The final aspect of thermal solution design is to determine the minimum speed the fan
will be allowed to operate. This value can be driven by the cooling requirements for
another portion of the design, such as the processor voltage regulator, or by
functional limits of the fan design.
Per the Fan Specification for 4 wire PWM Controlled Fans; there are three possible
options to consider
Type A: The fan will run at minimum RPM for all PWM duty cycle values less than
minimum duty cycle. This would be programmed into the fan controller located on
the fan hub. It can not be overridden by the external fan speed control.
Type B: The fan will run at minimum RPM for all non-zero PWM duty cycle values
less than minimum duty cycle and turn off the fan at 0% PWM duty cycle.
Type C: The fan will stop running when the current provided to the motor
windings is insufficient to support commutation. The fan would turn off at 0%
PWM duty cycle input.
For the reference thermal solution Type A was implemented.

Intel E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU Specifications

General

Brand	Intel
Model	E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU
Category	Computer Hardware
Language	English

Summary

Introduction

1.1 Document Goals and Scope

Outlines the purpose and boundaries of the thermal design guide.

Processor Thermal/Mechanical Information

2.1 Mechanical Requirements

Details physical and mechanical specifications for processor packages and heatsink attachments.

2.2 Thermal Requirements

Defines processor thermal limits, including thermal profile and TCONTROL.

2.3 Heatsink Design Considerations

Discusses key parameters for designing effective heatsinks.

2.4 System Thermal Solution Considerations

Thermal Metrology

3.1 Characterizing Cooling Performance Requirements

Explains thermal characterization parameters (psi) for evaluating cooling solutions.

3.3 Local Ambient Temperature Measurement Guidelines

3.4 Processor Case Temperature Measurement Guidelines

Details procedures for measuring processor case temperature (TC).

Thermal Management Logic and Thermal Monitor Feature

4.2 Thermal Monitor Implementation

Describes the components and functionality of the processor's thermal monitor.

Balanced Technology Extended (BTX) Thermal/Mechanical Design Information

5.1 Overview of the Balanced Technology Extended (BTX) Reference Design

Introduces the BTX reference design and its compliance.

5.2 Environmental Reliability Testing

Details testing for structural reliability, including vibration and shock.

5.4 Safety Requirements

Specifies safety standards for heatsink and attachment assemblies.

5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly

5.6 Preload and TMA Stiffness

Discusses preload requirements and stiffness for BTX platforms.

ATX Thermal/Mechanical Design Information

6.1 ATX Reference Design Requirements

Documents requirements for active air-cooled designs with top-mounted fans.

6.2 Validation Results for Reference Design

6.3 Environmental Reliability Testing

6.5 Safety Requirements

6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design

6.7 Reference Attach Mechanism

Details the design strategy for the reference attach mechanism.

Intel® Quiet System Technology (Intel® QST)

7.1 Intel® QST Algorithm

Explains the objective and methodology of the QST algorithm.

7.2 Board and System Implementation of Intel® QST

7.3 Intel® QST Configuration and Tuning

Describes how to configure and tune the QST subsystem.

7.4 Fan Hub Thermistor and Intel® QST

Appendix A LGA775 Socket Heatsink Loading

A.1 LGA775 Socket Heatsink Considerations

Discusses heatsink clip load for mechanical and thermal performance.

A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel® Reference Design

A.3 Heatsink Selection Guidelines

Appendix D Case Temperature Reference Metrology

D.1 Objective and Scope

Defines the procedure for attaching thermocouples for TC measurement.

D.2 Supporting Test Equipment

D.3 Thermal Calibration and Controls

D.4 IHS Groove

D.5 Thermocouple Attach Procedure

Provides a step-by-step guide for attaching thermocouples using solder.

D.6 Thermocouple Wire Management