ATX Thermal/Mechanical Design Information
Thermal and Mechanical Design Guidelines 61
6.3 Environmental Reliability Testing
6.3.1 Structural Reliability Testing
Structural reliability tests consist of unpackaged, board-level vibration and shock tests
of a given thermal solution in the assembled state. The thermal solution should meet
the specified thermal performance targets after these tests are conducted; however,
the test conditions outlined here may differ from your own system requirements.
6.3.1.1 Random Vibration Test Procedure
Duration: 10 min/axis, 3 axes
Frequency Range: 5 Hz to 500 Hz
Power Spectral Density (PSD) Profile: 3.13 G RMS
Figure 6-4. Random Vibration PSD
0.001
0.01
0.1
1 10 100 1000
Frequency (Hz)
3.13GRMS (10 minutes per axis)
5 Hz
500 Hz
(5, 0.01)
(20, 0.02) (500, 0.02)
6.3.1.2 Shock Test Procedure
Recommended performance requirement for a motherboard:
Quantity: 3 drops for + and - directions in each of 3 perpendicular axes (i.e.,
total 18 drops).
Profile: 50 G trapezoidal waveform, 170 in/sec minimum velocity change.
Setup: Mount sample board on test fixture.
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