Processor Thermal/Mechanical Information
Thermal and Mechanical Design Guidelines 19
Figure 2-2. Processor Case Temperature Measurement Location
37.5 mm
Measure T
C
at this point
(geometric center of the package)
37.5 mm
Measure T
C
at this point
(geometric center of the package)
2.2.2 Thermal Profile
The Thermal Profile defines the maximum case temperature as a function of processor
power dissipation. The TDP and Maximum Case Temperature are defined as the
maximum values of the thermal profile. By design the thermal solutions must meet
the thermal profile for all system operating conditions and processor power levels.
Refer to the processor datasheet for further information.
While the thermal profile provides flexibility for ATX /BTX thermal design based on its
intended target thermal environment, thermal solutions that are intended to function
in a multitude of systems and environments need to be designed for the worst-case
thermal environment. The majority of ATX /BTX platforms are targeted to function in
an environment that will have up to a 35 °C ambient temperature external to the
system.
Note: For ATX platforms, an active air-cooled design, assumed be used in ATX Chassis, with
a fan installed at the top of the heatsink equivalent to the reference design (see
Chapter 6) should be designed to manage the processor TDP at an inlet temperature
of 35 °C + 5 °C = 40 °C.
For BTX platforms, a front-to-back cooling design equivalent to Intel BTX TMA Type II
reference design (see the Chapter 5) should be designed to manage the processor TDP
at an inlet temperature of 35 °C + 0.5 °C = 35.5 °C.
The slope of the thermal profile was established assuming a generational
improvement in thermal solution performance of the reference design. For an example
of Intel
®
Core
™
2 Duo processor with 4 MB cache at Tc-max of 60.1 °C in ATX
platform, its improvement is about 16% over the Intel reference design (D60188-
001). This performance is expressed as the slope on the thermal profile and can be
thought of as the thermal resistance of the heatsink attached to the processor,
CA
(Refer to
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