Case Temperature Reference Metrology
Thermal and Mechanical Design Guidelines 89
Appendix DCase Temperature
Reference Metrology
D.1 Objective and Scope
This appendix defines a reference procedure for attaching a thermocouple to the IHS
of a 775-land LGA package for T
C
measurement. This procedure takes into account the
specific features of the 775-land LGA package and of the LGA775 socket for which it is
intended. The recommended equipment for the reference thermocouple installation,
including tools and part numbers are also provided. In addition a video Thermocouple
Attach Using Solder – Video CD-ROM is available that shows the process in real time.
The following supplier can do machining the groove and attaching a thermocouple to
the IHS followed by the reference procedure. The supplier is listed the following table
as a convenience to Intel’s general customers and the list may be subject to change
without notice.
Supplier Contact Phone Email Address
THERM-X OF
CALIFORNIA
Ernesto B
Valencia
510-441-7566
Ext. 242
ernestov@ther
m-x.com
1837 Whipple
Road, Hayward,
Ca 94544
D.2 Supporting Test Equipment
To apply the reference thermocouple attach procedure, it is recommended to use the
equipment (or equivalent) given in the following table.
Item Description Part Number
Measurement and Output
Microscope Olympus* Light microscope or equivalent SZ-40
DMM Digital Multi Meter for resistance measurement Fluke 79 Series
Thermal Meter Hand held thermocouple meter Multiple Vendors
Solder Station (see note 1 for ordering information)
Heater Block Heater assembly to reflow solder on IHS 30330
Heater WATLOW120V 150W Firerod 0212G G1A38-
L12
Transformer Superior Powerstat transformer 05F857
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