Intel E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU User Manual

Thermal and Mechanical Design Guidelines 7
Figure 7-21. Detailed Thermocouple Bead Placement ...........................................98
Figure 7-22. Third Tape Installation...................................................................98
Figure 7-23. Measuring Resistance Between Thermocouple and IHS .......................99
Figure 7-24. Applying Flux to the Thermocouple Bead ........................................100
Figure 7-25. Cutting Solder ............................................................................100
Figure 7-26. Positioning Solder on IHS.............................................................101
Figure 7-27. Solder Station Setup ...................................................................102
Figure 7-28. View Through Lens at Solder Station..............................................103
Figure 7-29. Moving Solder back onto Thermocouple Bead..................................103
Figure 7-30. Removing Excess Solder ..............................................................104
Figure 7-31. Thermocouple placed into groove ..................................................105
Figure 7-32. Removing Excess Solder ..............................................................105
Figure 7-33. Filling Groove with Adhesive.........................................................106
Figure 7-34. Application of Accelerant..............................................................106
Figure 7-35. Removing Excess Adhesive from IHS .............................................107
Figure 7-36. Finished Thermocouple Installation................................................107
Figure 7-37. Thermocouple Wire Management...................................................108
Figure 7-38. Thermistor Set Points ..................................................................110
Figure 7-39. Example Fan Speed Control Implementation ................................... 111
Figure 7-40. Fan Speed Control.......................................................................112
Figure 7-41. Temperature Range = 5 °C...........................................................113
Figure 7-42. Temperature Range = 10 °C......................................................... 114
Figure 7-43. On-Die Thermal Sensor and Thermistor..........................................115
Figure 7-44. FSC Definition Example................................................................117
Figure 7-45. System Airflow Illustration with System Monitor Point Area Identified .122
Figure 7-46. Thermal sensor Location Illustration .............................................. 123
Figure 7-47. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1.............................. 129
Figure 7-48. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2.............................. 130
Figure 7-49. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3.............................. 131
Figure 7-50. BTX Thermal Module Keep Out Volumetric – Sheet 1 ........................ 132
Figure 7-51. BTX Thermal Module Keep Out Volumetric – Sheet 2 ........................ 133
Figure 7-52. BTX Thermal Module Keep Out Volumetric – Sheet 3 ........................ 134
Figure 7-53. BTX Thermal Module Keep Out Volumetric – Sheet 4 ........................ 135
Figure 7-54. BTX Thermal Module Keep Out Volumetric – Sheet 5 ........................ 136
Figure 7-55. ATX Reference Clip – Sheet 1........................................................137
Figure 7-56. ATX Reference Clip - Sheet 2 ........................................................138
Figure 7-57. Reference Fastener - Sheet 1........................................................ 139
Figure 7-58. Reference Fastener - Sheet 2........................................................ 140
Figure 7-59. Reference Fastener - Sheet 3........................................................ 141
Figure 7-60. Reference Fastener - Sheet 4........................................................ 142
Figure 7-61. Intel
®
D60188-001 Reference Solution Assembly............................. 143
Figure 7-62. Intel
®
D60188-001 Reference Solution Heatsink..............................144
Figure 7-63. Intel
®
E18764-001 Reference Solution Assembly .............................145

Intel E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU Specifications

General

Brand	Intel
Model	E1400 - Celeron 2.0GHz 800MHz 512KB Socket 775 Dual-Core CPU
Category	Computer Hardware
Language	English