PCIe Compliance Testing Reference
PRELIMINARY INFORMATION
Jetson AGX Orin Series Tuning and Compliance Guide DA-11040-001_v0.7 | 11
Patch Attachments
The following two files are attached to this application note:
319ad28.diff: This file is the patch for disabling power down
9b39010.diff: This file is the patch for disabling the spread Spectrum
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Adobe Acrobat Reader or Adobe Acrobat). Select the files and use the Tool Bar options (
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Electrical Characterization
This section details the electrical characterization for the PCIe compliance testing.
Prerequisites
Note the following prerequisites for electrical characterization.
For a given design, boot the design using the OS to make sure all register settings (in
particular, pad register settings) are in line with production environment.
Make sure only the up-to-date modes supported by Jetson AGX Orin for this interface are
used. Refer to the
Jetson AGX Orin Design Guide
.
Note that this application note only deals with chip-down. This means that characterization
is performed for devices soldered down to the PCB. In case interfaces are realized through
PCIe slots or connectors, a similar but different approach may be needed. This application
note will highlight some but not all aspects of characterization DUT setup where needed to
avoid pitfalls. For all other information, refer to PCISIG specifications.
De-Embedding or Device Removal
Since this application note covers characterization for chip-down PCIe designs, the
characterization procedure must include handling a chip-down environment. Removing the
device is the standard way of characterizing chip-down PCIe connectivity. For PCIe transmit
characterization, it is required to remove the connected device, while for PCIe device
characterization it is required to remove the Orin module. Solder pads must be connected by
proper interconnects (solder tips for probes or breakout boards) to the scope.
Note that when the Orin module supplies REFCLK to a device and when device is tested with
the Orin module removed, REFCLK must be injected and supplied to the device. For more
REFCLK specifics, see “REFCLK Measurement and Characterization” section.
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