LTE Standard Module Series
EC21_Series_Hardware_Design
111
/ 118
7
Storage, Manufacturing and
Packaging
7.1. Storage Conditions
The module is provided with vacuum-sealed packaging. MSL of the module is rated as 3. The storage
requirements are shown below.
1. Recommended Storage Condition: The temperature should be 23 ±5 °C and the relative humidity
should be 35–60 %.
2. The storage life (in vacuum-sealed packaging) is 12 months in Recommended Storage Condition.
3. The floor life of the module is 168 hours
12
in a plant where the temperature is 23 ±5 °C and relative
humidity is below 60 %. After the vacuum-sealed packaging is removed, the module must be
processed in reflow soldering or other high-temperature operations within 168 hours. Otherwise, the
module should be stored in an environment where the relative humidity is less than 10 % (e.g. a
drying cabinet).
4. The module should be pre-baked to avoid blistering, cracks and inner-layer separation in PCB under
the following circumstances:
The module is not stored in Recommended Storage Condition;
Violation of the third requirement above occurs;
Vacuum-sealed packaging is broken, or the packaging has been removed for over 24 hours;
Before module repairing.
5. If needed, the pre-baking should follow the requirements below:
The module should be baked for 8 hours at 120 ±5 °C;
All modules must be soldered to PCB within 24 hours after the baking, otherwise they should be
put in a dry environment such as in a drying oven.
12
This floor life is only applicable when the environment conforms to IPC/JEDEC J-STD-033. It is recommended to start
the solder reflow process within 24 hours after the package is removed if the temperature and moisture do not conform to,
or are not sure to conform to IPC/JEDEC J-STD-033. And do not remove the packages of tremendous modules if they are
not ready for soldering.
To Next Page
Loading...
Need help?
General
