Quectel EC21 Series User Manual

LTE Standard Module Series
EC21_Series_Hardware_Design
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4
Within operating temperature range, the module is 3GPP compliant.
5
Within extended temperature range, the module remains the ability to establish and maintain a voice, SMS, data
transmission, emergency call*, etc. There is no unrecoverable malfunction. There are also no effects on radio spectrum
and no harm to radio network. Only one or more parameters like P
out
might reduce in their value and exceed the specified
tolerances. When the temperature returns to normal operation temperature levels, the module will meet 3GPP
specifications again.
 Supports long frame synchronization and short frame synchronization
 Supports master and slave modes, but must be the master in long
frame synchronization
USB Interface

Compliant with USB 2.0 specification (slave only); the data transfer rate
can reach up to 480 Mbps

Used for AT command communication, data transmission, GNSS
NMEA output, software debugging, firmware upgrade and voice over
USB

Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6–5.12,
Android 4.x–11.x, etc.
UART Interfaces
Main UART:
 Used for AT command communication and data transmission
 Baud rates reach up to 921600 bps, 115200 bps by default
 Support RTS and CTS hardware flow control
Debug UART:
 Used for Linux console and log output
 115200 bps baud rate by default
SD Card Interface
Supports SD 3.0 protocol
SGMII Interface

Supports 10M/100M/1000M Ethernet work mode

Supports Max. 10 Mbps (DL)/Max. 5 Mbps (UL) for 4G network
Interfaces WLAN and
Bluetooth Applications
 Support a low-power SDIO 3.0 interface for WLAN
 Support UART & PCM interfaces for Bluetooth
Rx-diversity Support LTE/WCDMA Rx-diversity
GNSS Features
 Protocol: NMEA 0183
 Data update rate: 1 Hz by default
AT Commands
 Compliant with 3GPP TS 27.007, 3GPP TS 27.005
 Quectel enhanced AT commands
Network Status
Indication
Two pins including NET_MODE and NET_STATUS to indicate network
connectivity status
Antenna Interfaces
 Main antenna interface (ANT_MAIN)
 Rx-diversity antenna interface (ANT_DIV)
 GNSS antenna interface (ANT_GNSS)
Physical Characteristics
 Size: (29.0 ±0.15) mm × (32.0 ±0.15) mm × (2.4 ±0.2) mm
 Weight: approx. 4.9 g
Temperature Range
Operating temperature range: -35 °C to +75 °C
4
Extended temperature range: -40 °C to +85 °C
5
Storage temperature range: -40 °C to +90 °C

Quectel EC21 Series Specifications

General

Category	Control Unit
Form Factor	LCC
Operating Temperature	-40°C to +85°C
Storage Temperature	-45°C to +90°C
Power Consumption	TBD
Network Support (LTE TDD)	B38/B40/B41
Network Support (GSM)	850/900/1800/1900 MHz
Module Type	LTE Cat 1
Supply Voltage	3.3V
Interface	USB 2.0
SIM Interface	1.8V/3.0V
Data Rate (Downlink)	10 Mbps
Data Rate (Uplink)	5Mbps
Network Support (LTE FDD)	B1/B3/B5/B8/B20
GNSS	GPS/GLONASS/BeiDou
Certifications	CE, FCC, GCF, PTCRB

Summary

2 Product Overview

2.1. Frequency Bands and Functions

2.2. Key Features

Details key features of the EC21 series module, including power supply and transmission.

3 Application Interfaces

3.2. Pin Assignment

Visual representation of the EC21 series module's pin assignment (top view).

3.3. Pin Description

Detailed description of each pin's I/O type, function, and characteristics.

3.5. Power Saving

4 RF Specifications

4.1. Cellular Network

Details antenna interfaces, frequency bands, and operating frequencies for cellular network.

4.2. GNSS

Covers GNSS antenna interface, frequencies, and performance metrics.

4.4. Antenna Design Requirements

5 Electrical Characteristic and Reliability

5.1. Absolute Maximum Ratings

5.2. Power Supply Ratings

5.4. Power Consumption

Presents current consumption values for various operating states and conditions.

5.5. ESD

5.6. Thermal Dissipation

6 Mechanical Information

6.1. Mechanical Dimensions

Provides the physical dimensions and tolerances of the EC21 module.

6.2. Recommended Footprint

Offers a recommended PCB footprint for the EC21 series module.

7 Storage, Manufacturing and Packaging

7.2. Manufacturing and Soldering

Guides on manufacturing processes, soldering, and thermal profiles.