LTE Standard Module Series
EM05-G Hardware Design
EM05-G_Hardware_Design 65 / 69
6.5. Thermal Dissipation
EM05-G is designed to work over an extended temperature range. To achieve a maximum performance
while working under extended temperatures or extreme conditions (such as with maximum power or data
rate, etc.) for a long time, it is strongly recommended to add a thermal pad or other thermally conductive
compounds between the module and the main PCB for thermal dissipation.
There are other measures to enhance heat dissipation performance:
⚫ Add as many ground vias as possible on the PCB.
⚫ Maximize airflow over/around the module.
⚫ Place the module away from other heating sources.
⚫ Module mounting holes must be used to attach (ground) the device to the main PCB ground.
⚫ It is NOT recommended to apply solder mask on the main PCB where the module’s thermal
dissipation area is located.
⚫ Select appropriate material, thickness and surface for the outer housing of the application device that
integrates the module (i.e., the mechanical enclosure) to enhance thermal dissipation ability. You
may also need active cooling to dissipate heat of the module.
⚫ If possible, add a heatsink on the top of the module. A thermal pad should be used between the
heatsink and the module, and the heatsink should be designed with as many fins as possible to
increase heat dissipation area.
If a conformal coating is necessary for the module, do NOT use any coating material that may chemically
react with the PCB or shielding cover, and prevent the coating material from flowing into the module.
To Next Page
Loading...
Need help?
General
