Installing and connecting the device
3.3 Connecting the device
SIMATIC IPC847D
Operating Instructions, 01/2014, A5E32997454-AA
41
Fault caused by I/O devices
The connection of I/O devices can cause faults in the device. The result may be personal
injury and damage to the machine or plant. Note the following:
• Connect only I/O devices which are approved for industrial applications in accordance
with EN 61000-6-2/IEC 61000-6-2.
• Peripheral devices that are incapable of hot-plugging may only be connected after the
device has been disconnected from the power supply.
Damage through regenerative feedback
Regenerative feedback of voltage to ground by a connected or installed component can
damage the device.
Connected or built-in I/Os, for example, a USB drive, are not permitted to supply any
voltage to the device. Regenerative feedback is generally not permitted.
Connection of equipotential bonding
A low-impedance ground connection improves the discharge of interference generated by
external power cables, signal cables or cables for I/O modules to ground.
This equipotential bonding connection has the following properties:
● large surface
● large surface area contacts
● M4 thread
● Symbol on the device:
● TORX T20 screwdriver
Connect the equipotential bonding connection ①
on the
evice with the central ground of the control cabinet or the
plant in which the device is installed. The minimum cross
-
section of the equipotential bonding cable may not be less
than 2.5 mm
2
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