Dell PowerEdge R330 User Manual

Figure 23. Memory socket locations on the system board
Memory channels are organized as follows:
Processor 1
channel 0: memory sockets A1 and A3
channel 1: memory sockets A2 and A4
The following table shows the memory populations and operating frequencies for the supported congurations:
Table 20. Memory populations and operating frequencies for the supported congurations
Memory module type Memory modules
populated per
channel
Operating frequency (in
MT/s)
Maximum memory module ranks
per channel
1.2 V
ECC (UDIMM) 1 1600, 1866, 2133, 2400 Dual rank or single rank
2 1600, 1866, 2133, 2400 Dual rank or single rank
General memory module installation guidelines
Your system supports Flexible Memory Conguration, enabling the system to be congured and run in any valid chipset architectural
conguration. The following are the recommended guidelines for installing memory modules:
• x4 and x8 DRAM-based DIMMs can be mixed.
• Up to two dual- or single-rank ECC UDIMMs can be populated per channel.
• Populate DIMM sockets only if a processor is installed. For single-processor systems, sockets A1 to A4 are available.
• Populate all sockets with white release levers rst, and then all the sockets with black release levers.
• When mixing memory modules with dierent capacities, populate the sockets with memory modules with the highest capacity
rst. For example, if you want to mix 4 GB and 8 GB DIMMs, populate 8 GB DIMMs in the sockets with white release levers and
4 GB DIMMs in the sockets with black release levers.
• Memory modules of dierent capacities can be mixed provided other memory population rules are followed (for example, 4 GB
and 8 GB memory modules can be mixed).
• Mixing of more than two DIMM capacities in a system is not supported.
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Dell PowerEdge R330 Specifications

General

Dell E-Value Code	PER3303a
Processor cache	8 MB
Processor cores	4
Processor model	E3-1220V6
System bus rate	8 GT/s
Processor socket	LGA 1151 (Socket H4)
Motherboard chipset	Intel® C236
Processor frequency	3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor boost frequency	3.5 GHz
Compatible processor series	Intel® Xeon®
Number of processors installed	1
Performance management	IPMI 2.0, Dell OpenManage
Trusted Platform Module (TPM)	Yes
Operating system installed	No
Compatible operating systems	Microsoft Windows Server 2012 R2 Microsoft Windows Server 2012 Red Hat Enterpise Linux SUSE Linux Enterprise Server 12 SP1 SUSE Linux Enterprise Server 11 SP4 VMware vSphere ESXi
Memory slots	4x DIMM
Internal memory	4 GB
Memory clock speed	2400 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	64 GB
Memory layout (slots x size)	1 x 4 GB
HDD size	3.5 \
HDD speed	7200 RPM
RAID support	-
HDD interface	Serial ATA III
Optical drive type	DVD±RW
Total storage capacity	1000 GB
Maximum storage capacity	- TB
Supported storage drive interfaces	SAS, Serial ATA III
Chassis type	Rack (1U)
Power supply	350 W
Power supply input frequency	50 - 60 Hz
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Gigabit Ethernet
USB 2.0 ports quantity	2
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 12000 m
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	10 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 80 %

Weight and Dimensions

Depth	625 mm
Width	434 mm
Height	42.8 mm
Weight	13800 g