Dell PowerEdge T30 User Manual

Type Condition Temperature or Specification
Storage Six consecutively executed shock pulses in the positive and
negative x, y, and z axes (one pulse on each side of the
system) of 105 G for up to 2 ms.
Maximum Altitude
Operating 3,048 m (10,000 ft)
Storage 35,000 m (10,688 ft)
Operating Altitude De-rating
Up to 35 °C (95 °F) Maximum temperature is reduced by 1 °C/300 m (1 °F/547
ft) above 950 m (3,117 ft).
35 °C to 40 °C (95 °F to 104 °F) Maximum temperature is reduced by 1 °C/175 m (1 °F/319
ft) above 950 m (3,117 ft).
40 °C to 45 °C (104 °F to 113 °F) Maximum temperature is reduced by 1 °C/125 m (1 °F/228
ft) above 950 m (3,117 ft).
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulates and gaseous contamination. If
the levels of particulates or gaseous pollution exceed the specified limitations and result in equipment damage or failure, you may need to
rectify the environmental conditions. Re-mediation of environmental conditions is the responsibility of the customer.
NOTE
: This section defines the limits to help avoid IT equipment damage and/or failure from particulates and gaseous
contamination. If it is determined that levels of particulates or gaseous pollution are beyond the limits specified in the following
table and are the reason for the damage and/or failures to your equipment, it may be necessary for you to re-mediate the
environmental conditions that are causing the damage and/or failures. Re-mediation of environmental conditions will be the
responsibility of the customer.
Table 18. Particulate contamination specifications
Particulate contamination Specifications
Air Filtration
NOTE: Applies to data center environments only. Air filtration
requirements do not apply to IT equipment designed to be used
outside a data center, in environments such as an office or
factory floor.
Data center air filtration as defined by ISO Class 8 per ISO
14644-1 with a 95% upper confidence limit.
NOTE: Air entering the data center must have
MERV11 or MERV13 filtration.
Conductive Dust
NOTE: Applies to data center and non-data center
environments.
Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
Corrosive Dust
NOTE: Applies to data center and non-data center
environments.
• Air must be free of corrosive dust.
• Residual dust present in the air must have a deliquescent
point less than 60% relative humidity.
Table 19. Gaseous contamination specifications
Gaseous contamination Specifications
Copper Coupon Corrosion Rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-1985.
Technical specifications 21

Dell PowerEdge T30 Specifications

General

Bus type	DMI3
Stepping	R0
Scalability	1S
Processor code	SR2DC
Processor cache	3 MB
Processor cores	2
Processor model	G4400
System bus rate	8 GT/s
Processor family	Intel Pentium G
Processor series	Intel Pentium G4400 series for Desktop
Processor socket	LGA 1151 (Socket H4)
Processor codename	Skylake
Execute Disable Bit	Yes
Motherboard chipset	Intel® C236
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor operating modes	32-bit, 64-bit
PCI Express configurations	1x16, 1x8+2x4, 2x8
Supported instruction sets	SSE4.1, SSE4.2
Thermal Design Power (TDP)	47, 54 W
Number of processors installed	1
Thermal solution specification	PCG 2015C
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1866, 1333, 2133, 1600 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	64 GB
HDD size	- \
HDD interface	-
Optical drive type	No
Total storage capacity	1000 GB
Maximum storage capacity	- TB
Memory slots	4
Internal memory	4 GB
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Fast Ethernet, Gigabit Ethernet
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
VGA (D-Sub) ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	6
PCI Express x4 slots	7
PCI Express slots version	3.0
Compatible operating systems	- Microsoft Windows Server 2012; 2012 R2; 2016 - Red Hat Enterprise Linux - Ubuntu Server 14.04/16.04
Chassis type	Mini Tower
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 35000 m
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 80 %
On-board graphics card ID	0x1902
On-board graphics card model	Intel® HD Graphics 510
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.7 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Number of displays supported (on-board graphics)	3
Processor ARK ID	88179
Intel Secure Key Technology version	1.00
Intel Small Business Advantage (SBA) version	0.00

Weight and Dimensions

Depth	454 mm
Width	175 mm
Height	360 mm
Weight	11700 g