Dell PowerEdge T30 User Manual

Next steps
NOTE: Ensure that you install the heat sink after you install the processor. The heat sink is necessary to maintain proper thermal
conditions.
1 Install the heat sink.
2 Follow the procedure listed in the After working inside your system.
3 While booting, press F2 to enter System Setup and verify that the processor information matches the new system configuration.
4 Run the system diagnostics to verify that the new processor operates correctly.
Related links
Before working inside your system
Installing a heat sink
After working inside your system
Installing a heat sink
Prerequisites
CAUTION: Many repairs may only be done by a certified service technician. You should only perform troubleshooting and simple
repairs as authorized in your product documentation, or as directed by the online or telephone service and support team.
Damage due to servicing that is not authorized by Dell is not covered by your warranty. Read and follow the safety instructions
that are shipped with your product.
1 Follow the safety guidelines listed in the Safety instructions section.
2 Follow the procedure listed in the Before working inside your system section.
3 Install the processor.
4 If you are using an existing heat sink, remove the thermal grease from the heat sink by using a clean lint-free cloth.
5 Keep the Phillips #2 screwdriver ready.
Steps
1 Place the heat sink onto the processor.
NOTE
: Ensure that the CPU fan cable is close to its connector on the system board
2 Tighten one of the four screws to secure the heat sink to the system board.
3 Tighten the screw diagonally opposite to the first screw that you tightened.
NOTE
: Do not over-tighten the heat sink retention screws when installing the heat sink. To prevent over-tightening,
tighten the retention screw until resistance is felt, and stop after the screw is seated. The screw tension should not be
more than 6 in-lb (6.9 kg-cm).
4 Repeat the procedure for the remaining two screws.
82
Installing and removing system components

Dell PowerEdge T30 Specifications

General

Bus type	DMI3
Stepping	R0
Scalability	1S
Processor code	SR2DC
Processor cache	3 MB
Processor cores	2
Processor model	G4400
System bus rate	8 GT/s
Processor family	Intel Pentium G
Processor series	Intel Pentium G4400 series for Desktop
Processor socket	LGA 1151 (Socket H4)
Processor codename	Skylake
Execute Disable Bit	Yes
Motherboard chipset	Intel® C236
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor operating modes	32-bit, 64-bit
PCI Express configurations	1x16, 1x8+2x4, 2x8
Supported instruction sets	SSE4.1, SSE4.2
Thermal Design Power (TDP)	47, 54 W
Number of processors installed	1
Thermal solution specification	PCG 2015C
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1866, 1333, 2133, 1600 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	64 GB
HDD size	- \
HDD interface	-
Optical drive type	No
Total storage capacity	1000 GB
Maximum storage capacity	- TB
Memory slots	4
Internal memory	4 GB
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Fast Ethernet, Gigabit Ethernet
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
VGA (D-Sub) ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	6
PCI Express x4 slots	7
PCI Express slots version	3.0
Compatible operating systems	- Microsoft Windows Server 2012; 2012 R2; 2016 - Red Hat Enterprise Linux - Ubuntu Server 14.04/16.04
Chassis type	Mini Tower
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 35000 m
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 80 %
On-board graphics card ID	0x1902
On-board graphics card model	Intel® HD Graphics 510
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.7 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Number of displays supported (on-board graphics)	3
Processor ARK ID	88179
Intel Secure Key Technology version	1.00
Intel Small Business Advantage (SBA) version	0.00

Weight and Dimensions

Depth	454 mm
Width	175 mm
Height	360 mm
Weight	11700 g