Dell PowerEdge T30 User Manual

• Populate all sockets with white release tabs first, and then all the sockets with black release tabs.
• Populate the sockets by the highest rank count, in the following order—first in sockets with white release tabs and then with the black
release tabs. For example, if you want to mix single-rank and dual-rank memory modules, populate dual-rank memory modules in the
sockets with white release tabs and single-rank memory modules in the sockets with black release tabs.
• Memory modules of different capacities can be mixed provided other memory population rules are followed (for example, 2 GB and 4
GB memory modules can be mixed).
• When mixing memory modules with different capacities, populate the sockets with memory modules with highest capacity first. For
example, if you want to mix 2 GB and 4 GB memory modules, populate 4 GB memory modules in the sockets with white release tabs
and 2 GB memory modules in the sockets with black release tabs.
• If memory modules with different speeds are installed, they will operate at the speed of the slowest installed memory module(s) or
slower depending on system DIMM configuration.
Sample memory configurations
The following table shows sample memory configurations for a single processor configuration that follow the appropriate memory
guidelines stated in this section.
CAUTION: Dell recommends you to use ECC DIMMs to minimize the risk of uncorrectable system error, data loss and/or silent
data corruption. Non-ECC DIMM is not used for mission-critical applications.
NOTE: 16 GB quad-rank RDIMMs are not supported.
NOTE: 1R and 2R in the following tables indicate single-rank and dual-rank DIMMs respectively.
NOTE: Non-ECC DIMMs are supported only in selected countries, for more information contact your sales representative.
NOTE: When the 2400 MHz non-ECC modules are used in the system, the system memory speed drops to 2133 MHz. This is a
BIOS restriction.
Table 36. Memory configurations
Populated system
capacity (in GB)
Memory
module size
(in GB)
Number of
memory
modules
Memory module rank,
organization, and
frequency
Memory type Memory module
slot population
4 4 1
1R, x8, 2133 MT/s,
1R, x8, 2400 MT/s
ECC
Non-ECC
1
8 4 2
1R, x8, 2133 MT/s,
1R, x8, 2400 MT/s
ECC
Non-ECC
1, 2
16 4 4
1R, x8, 2133 MT/s,
1R, x8, 2400 MT/s
ECC
Non-ECC
1, 2, 3, 4
8 2
2R, x8, 2133 MT/s,
2R, x8, 2400 MT/s
ECC
Non-ECC
1, 2
32 8 4
2R, x8, 2133 MT/s,
2R, x8, 2400 MT/s
ECC
Non-ECC
1, 2, 3, 4
16 2
2R, x8, 2133 MT/s,
2R, x8, 2400 MT/s
ECC
Non-ECC
1, 2
64 16 4
2R, x8, 2133 MT/s, ECC 1, 2, 3, 4
Installing and removing system components 71

Dell PowerEdge T30 Specifications

General

Bus type	DMI3
Stepping	R0
Scalability	1S
Processor code	SR2DC
Processor cache	3 MB
Processor cores	2
Processor model	G4400
System bus rate	8 GT/s
Processor family	Intel Pentium G
Processor series	Intel Pentium G4400 series for Desktop
Processor socket	LGA 1151 (Socket H4)
Processor codename	Skylake
Execute Disable Bit	Yes
Motherboard chipset	Intel® C236
Processor frequency	3.3 GHz
Processor cache type	Smart Cache
Processor lithography	14 nm
Processor manufacturer	Intel
Processor package size	37.5 x 37.5 mm
Processor front side bus	- MHz
Processor operating modes	32-bit, 64-bit
PCI Express configurations	1x16, 1x8+2x4, 2x8
Supported instruction sets	SSE4.1, SSE4.2
Thermal Design Power (TDP)	47, 54 W
Number of processors installed	1
Thermal solution specification	PCG 2015C
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory channels supported by processor	Dual
Memory clock speeds supported by processor	1866, 1333, 2133, 1600 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Maximum internal memory supported by processor	64 GB
HDD size	- \
HDD interface	-
Optical drive type	No
Total storage capacity	1000 GB
Maximum storage capacity	- TB
Memory slots	4
Internal memory	4 GB
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Cabling technology	10/100/1000Base-T(X)
Ethernet interface type	Fast Ethernet, Gigabit Ethernet
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
VGA (D-Sub) ports quantity	0
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	6
PCI Express x4 slots	7
PCI Express slots version	3.0
Compatible operating systems	- Microsoft Windows Server 2012; 2012 R2; 2016 - Red Hat Enterprise Linux - Ubuntu Server 14.04/16.04
Chassis type	Mini Tower
Operating altitude	0 - 3048 m
Non-operating altitude	0 - 35000 m
Storage temperature (T-T)	-40 - 65 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 80 %
On-board graphics card ID	0x1902
On-board graphics card model	Intel® HD Graphics 510
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1.7 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	350 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Number of displays supported (on-board graphics)	3
Processor ARK ID	88179
Intel Secure Key Technology version	1.00
Intel Small Business Advantage (SBA) version	0.00

Weight and Dimensions

Depth	454 mm
Width	175 mm
Height	360 mm
Weight	11700 g