HP MSR2000 Series User Manual

2
Temperature and humidity
You must maintain a proper temperature and humidity in the equipment room.
 Lasting high relative humidity tends to cause poor insulation, electricity creepage, mechanical
property change of materials, and corrosion of metal parts.
 Lasting low relative humidity is likely to result in loose screws due to washer contraction, and even
ESD, which causes the circuits to fail.
 A high temperature is the most undesirable condition, because it accelerates the aging of insulation
materials and significantly lowers reliability and service life of the router.
For the temperature and humidity requirements of the MSR3000 router, see Table 1.
Table 1 Temperature and humidity requirements
Tem
p
erature Humidit
y
0°C to 45°C (32°F to 113°F) 5% to 90% (noncondensing)
Cleanness
Dust buildup on the chassis might result in electrostatic adsorption, which causes poor contact of metal
components and contact points, especially when indoor relative humidity is low. In the worst case,
electrostatic adsorption can cause communication failure.
Table 2 Dust concentration limit in the equipment room
Substance Concentration limit (
p
articles/m
3
)
Dust particles
≤ 3 x 10
4
(No visible dust on desk in three days)
NOTE:
Dust particle diameter ≥ 5 μm
The equipment room must also meet strict limits on salts, acids, and sulfides to eliminate corrosion and
premature aging of components, as shown in Table 3.
Table 3 Harmful gas limits in the equipment room
Gas Max. (m
g
/m
3
)
SO
2
0.2
H
2
S 0.006
NH
3
0.05
Cl
2
0.01
Cooling system
The MSR3012/3024 router adopts left to right airflow for heat dissipation, and the MSR3044/3064
router adopts left to rear airflow for heat dissipation.

HP MSR2000 Series Specifications

General

Brand	HP
Model	MSR2000 Series
Category	Network Router
Language	English