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HP Z240 User Manual

HP Z240
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Electrostatic discharge (ESD) information
Generating static Dierent activities generate dierent amounts of static electricity through electrostatic discharge (ESD).
Static electricity increases as humidity decreases.
CAUTION: Static electricity in the amount of 700 volts might degrade a product.
Event
Relative humidity
55% 40% 10%
Walking across carpet
Walking across vinyl oor
Motions of bench worker
7,500 V
3,000 V
400V
15,000 V
5,000 V
800 V
35,000 V
12,000 V
6,000 V
Removing bubble pack from PCB
Packing PCBs in foam-lined box
7,000 V
5,000 V
20,000 V
11,000 V
26,500 V
21,000 V
Preventing ESD
equipment damage
Many electronic components are sensitive to ESD. Circuitry design and structure determine the degree of
sensitivity. The following packaging and grounding precautions are necessary to prevent damage to
electronic components and accessories:
Transport products in static-safe containers such as tubes, bags, or boxes, to avoid hand contact.
Protect electrostatic parts and assemblies with nonconductive or approved containers or
packaging.
Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations.
Place items on a grounded surface before removing them from containers.
Before handling or touching a sensitive component or assembly, ground yourself by touching a
grounded metal object.
Avoid contact with pins, leads, or circuitry.
Place reusable electrostatic-sensitive parts from assemblies in protective packaging or
nonconductive foam.
Personal grounding
methods and
equipment
Use the following items to help prevent ESD damage:
Wrist straps — These are exible straps with a maximum of one megohm ± 10% resistance in the
ground cords. To provide a proper ground, wear the strap against bare skin. The ground cord must
be connected and t snugly into the banana plug connector on the grounding mat or computer.
Heel straps, toe straps, and boot straps — These can be used at standing computers and are
compatible with most types of shoes or boots. On conductive oors or dissipative oor mats, use
them on both feet with a maximum of one megohm ± 10% resistance between the operator and
ground.
Static shielding
materials
Static shielding materials provide the following levels of protection.
Method
Antistatic plastic
Carbon-loaded plastic
Metalized laminate
Voltage
1,500 V
7,500 V
15,000 V
Grounding the work
area to prevent static
damage
Cover the work surface with approved
static-dissipative material. Use a wrist strap
connected to the work surface, and properly
grounded tools and equipment.
Use static-dissipative mats, foot straps, or
air ionizers to give added protection.
Disconnect power and input signals before
inserting and removing connectors or test
equipment.
Use xtures made of static-safe materials
when xtures must directly contact dissipative
surfaces.
Service considerations 43

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HP Z240 Specifications

General IconGeneral
Chassis typeTower
Product colorBlack
Country of originChina
Water cooling systemNo
Product typeWorkstation
Motherboard chipsetIntel® C236
Memory slots4x DIMM
Internal memory8 GB
Memory channelsDual-channel
Memory clock speed2133 MHz
Internal memory typeDDR4-SDRAM
Maximum internal memory64 GB
Memory layout (slots x size)2 x 4 GB
HDD speed7200 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi
Card reader integrated-
Total storage capacity1000 GB
Number of HDDs installed1
On-board graphics card ID0x191D
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics P530
Graphics card Open GL supportYes
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory1 GB
On-board graphics card OpenGL version4.4
On-board graphics card base frequency400 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1150 MHz
Number of displays supported (on-board graphics)3
Power supply400 W
Recovery operating systemWindows 10 Pro
Operating system installedWindows 7 Professional
Operating system architecture64-bit
Ethernet LAN data rates10, 100, 1000 Mbit/s
USB 2.0 ports quantity4
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity6
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity0
Tcase- °C
Bus typeDMI3
SteppingR0
Processor cache8 MB
Processor modelE3-1245V5
System bus rate8 GT/s
Processor seriesIntel Xeon E3-1200 v5
Processor socketLGA 1151 (Socket H4)
Processor threads8
Processor codenameSkylake
Processor frequency3.5 GHz
Processor cache typeSmart Cache
Configurable TDP-down- W
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency3.9 GHz
PCI Express configurations1x16, 1x8+2x4, 2x8
Thermal Design Power (TDP)80 W
Maximum number of PCI Express lanes16
Memory types supported by processorDDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor1.35 V
Memory clock speeds supported by processor1333, 1600, 1866, 2133 MHz
Memory bandwidth supported by processor (max)34.1 GB/s
Scalability1S
Processor ARK ID88173
Processor package size37.5 x 37.5 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Secure Key Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Depth442 mm
Width170 mm
Height399 mm
Weight8600 g

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