HP Z240 User Manual

●
Handle electrostatic-sensitive components,
parts, and assemblies by the case or PCB
laminate. Handle them only in static-free
work areas.
●
Keep work area free of conductive materials,
such as plastic assembly aids and Styrofoam.
●
Use eld service tools (such as cutters,
screwdrivers, and vacuums) that are non-
conductive.
Recommended ESD
prevention materials
and equipment
●
Antistatic tape
●
Antistatic smocks, aprons, and sleeve
protectors
●
Non-conductive bins and other assembly or
soldering aids
●
Non-conductive foam
●
Non-conductive tabletop computers with a
ground cord of one megohm ± 10%
resistance
●
Static-dissipative table or oor mats with a
hard-tie to ground
●
Field service kits
●
Static awareness labels
●
Wrist straps and footwear straps providing one
megohm ± 10% resistance
●
Material-handling packages
●
Non-conductive plastic bags
●
Non-conductive plastic tubes
●
Non-conductive tote boxes
●
Opaque shielding bags
●
Transparent metallized shielding bags
●
Transparent shielding tubes
Product recycling
HP encourages customers to recycle used electronic hardware, HP original print cartridges, and rechargeable
batteries.
For information about recycling HP components or products, see http://www.hp.com/go/recycle.
Component replacement guidelines
This section provides information and guidelines for removal and replacement procedures. It does not
document the step-by-step procedures.
IMPORTANT: Removal and replacement procedures are now available in videos on the HP website.
Go to the HP Customer Self Repair Services Media Library at http://www.hp.com/go/sml. In Media Selection,
choose the Desktops & Workstations product category and the Personal Workstations product family, then
choose your platform
This chapter provides guidelines for removal and replacement procedures.
Battery on page 45
Cable management on page 45
CPU (processor) and CPU heatsink on page 46
Expansion slots on page 47
Hard drives and optical disc drives on page 51
Memory on page 53
Power supply specications on page 56
System board on page 57
44 Chapter 3 Component replacement information and guidelines

HP Z240 Specifications

General

Chassis type	Tower
Product color	Black
Country of origin	China
Water cooling system	No
Product type	Workstation
Motherboard chipset	Intel® C236
Memory slots	4x DIMM
Internal memory	8 GB
Memory channels	Dual-channel
Memory clock speed	2133 MHz
Internal memory type	DDR4-SDRAM
Maximum internal memory	64 GB
Memory layout (slots x size)	2 x 4 GB
HDD speed	7200 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi
Card reader integrated	-
Total storage capacity	1000 GB
Number of HDDs installed	1
On-board graphics card ID	0x191D
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics P530
Graphics card Open GL support	Yes
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	1 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	400 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1150 MHz
Number of displays supported (on-board graphics)	3
Power supply	400 W
Recovery operating system	Windows 10 Pro
Operating system installed	Windows 7 Professional
Operating system architecture	64-bit
Ethernet LAN data rates	10, 100, 1000 Mbit/s
USB 2.0 ports quantity	4
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	6
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity	0
Tcase	- °C
Bus type	DMI3
Stepping	R0
Processor cache	8 MB
Processor model	E3-1245V5
System bus rate	8 GT/s
Processor series	Intel Xeon E3-1200 v5
Processor socket	LGA 1151 (Socket H4)
Processor threads	8
Processor codename	Skylake
Processor frequency	3.5 GHz
Processor cache type	Smart Cache
Configurable TDP-down	- W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.9 GHz
PCI Express configurations	1x16, 1x8+2x4, 2x8
Thermal Design Power (TDP)	80 W
Maximum number of PCI Express lanes	16
Memory types supported by processor	DDR3L-SDRAM, DDR4-SDRAM
Memory voltage supported by processor	1.35 V
Memory clock speeds supported by processor	1333, 1600, 1866, 2133 MHz
Memory bandwidth supported by processor (max)	34.1 GB/s
Scalability	1S
Processor ARK ID	88173
Processor package size	37.5 x 37.5 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Secure Key Technology version	1.00

Weight and Dimensions

Depth	442 mm
Width	170 mm
Height	399 mm
Weight	8600 g