Chapter 2. Architecture and technical overview 51
2.5 Technical comparison
Table 2-7 shows a comparison of the technical aspects of the PS700, PS701, and PS702
blade compared to a Power 750 Express.
Table 2-7 Comparison of technical characteristics between PS blades and the Power 750 Express
Systems characteristic PS700 PS701 PS702 Power 750 Express
Processor 4-cores at 3.0
GHz
8-cores at 3.0
GHz
16-cores at 3.0
GHz
6-cores at 3.3 GHz
8-cores at 3.0 GHz, 3.3 GHz,
3.55 GHz
Pluggable processor cards Not Applicable Not Applicable Not Applicable 1–4
Min./Max. processor cores 4 8 16 6/24 (6-core) or 8/32 (8-core)
L3 cache On-chip
eDRAM
On-chip
eDRAM
On-chip
eDRAM
On-chip eDRAM
Max memory slots and type 8 DDR3 16 DDR3 32 DDR3 8 slots per processor card
(32 slots max.), DDR3
Memory chipkill Yes Yes Yes Yes
Memory spare No No No Yes
Memory hotplug No No No No
EnergyScale device Yes Yes Yes Yes
PCIe x8 slots 2 2 4 3
PCI-X 2.0 slots 0 0 0 2
PCIe and PCI-X hot plug No No No Yes
Integrated Virtual Ethernet Ports /
Speed
Integrated
2 /1 Gb
Integrated
2 / 1 Gb
Integrated
4 / 1 Gb
daughter card
quad port / 1 Gb
or
dual port / 10 Gb
PowerVM support Yes Yes Yes Yes
Capacity on Demand No No No No
Redundant hotplug power Yes through
chassis
Yes through
chassis
Yes through
chassis
Ye s
DASD bays 2 1 2 8 (hot-plug, front access,
SFF)
GX slot
(GX+ slot does not support RIO2)
Not applicable Not applicable Not applicable 1 x GX+ slot and 1 x GX++
slot (not hot pluggable)
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