Do not use solder containing lead.
This product has been manufactured using lead-free solder
in order to help preserve the environment.
Because of this, be sure to use lead-free solder when
carrying out repair work, and never use solder containing
lead.
Lead-free solder has a melting point that is 30–40 °C (86–
104 °F) higher than solder containing lead, and moreover it
does not contain lead which attaches easily to other metals.
As a result, it does not melt as easily as solder containing
lead, and soldering will be more difficult even if the
temperature of the soldering iron is increased.
The extra difficulty in soldering means that soldering time
will increase and damage to the components or the circuit
board may easily occur.
Because of this, you should use a soldering iron and solder
that satisfy the following conditions when carrying out
repair work. Also, soldering work must be done in a short
time.
Soldering iron
Use a soldering iron which is 70 W or equivalent, and
which lets you adjust the tip temperature up to 450 °C
(842 °F) It should also have as good temperature recovery
characteristics as possible.
Solder
Use solder with the metal content and composition ratio by
weight given in the table below. Do not use solders which
do not meet these conditions.
Note:
If replacing existing solder containing lead with lead-free
solder in the soldered parts of products that have been
manufactured up until now, remove all of the existing solder
at those parts before applying the lead-free solder.
Metal content Tin (Sn) Silver (Ag) Copper (Cu)
Composition
ratio by weight
96.5 % 3.0 % 0.5 %
Note on Soldering
Diagrams & Drawings (PLC-XF47)
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General
Weight and Dimensions
