Dell E33S001 User Manual

Figure 23. Memory socket locations on the system board
Memory channels are organized as follows:
Processor 1
channel 0: memory sockets A1 and A3
channel 1: memory sockets A2 and A4
The following table shows the memory populations and operating frequencies for the supported congurations:
Table 20. Memory populations and operating frequencies for the supported congurations
Memory module type Memory modules
populated per
channel
Operating frequency (in
MT/s)
Maximum memory module ranks
per channel
1.2 V
ECC (UDIMM) 1 1600, 1866, 2133, 2400 Dual rank or single rank
2 1600, 1866, 2133, 2400 Dual rank or single rank
General memory module installation guidelines
Your system supports Flexible Memory Conguration, enabling the system to be congured and run in any valid chipset architectural
conguration. The following are the recommended guidelines for installing memory modules:
• x4 and x8 DRAM-based DIMMs can be mixed.
• Up to two dual- or single-rank ECC UDIMMs can be populated per channel.
• Populate DIMM sockets only if a processor is installed. For single-processor systems, sockets A1 to A4 are available.
• Populate all sockets with white release levers rst, and then all the sockets with black release levers.
• When mixing memory modules with dierent capacities, populate the sockets with memory modules with the highest capacity
rst. For example, if you want to mix 4 GB and 8 GB DIMMs, populate 8 GB DIMMs in the sockets with white release levers and
4 GB DIMMs in the sockets with black release levers.
• Memory modules of dierent capacities can be mixed provided other memory population rules are followed (for example, 4 GB
and 8 GB memory modules can be mixed).
• Mixing of more than two DIMM capacities in a system is not supported.
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Dell E33S001 Specifications

General

Brand	Dell
Model	E33S001
Category	Server
Language	English