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IBM BladeCenter HS22 User Manual

IBM BladeCenter HS22
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System reliability guidelines
Use this information to make sure that the blade server meets the proper cooling
and reliability guidelines.
To help make sure that proper cooling and system reliability requirements are met,
review the following guidelines:
v To ensure proper cooling, do not operate the BladeCenter unit without a blade
server, expansion unit, or blade filler installed in each blade-server bay. See the
documentation for your BladeCenter unit for additional information.
v Each microprocessor socket always contains either a microprocessor dust cover
and heat sink filler or a microprocessor and heat sink. If the blade server has
only one microprocessor, it must be installed in microprocessor socket 1.
v Each DIMM socket always contains a memory module or filler.
v Each hot-swap SAS bay contains a SAS storage drive or filler.
v Make sure that the ventilation holes on the blade server are not blocked.
v The blade server battery must be operational. If the battery becomes defective,
replace it immediately. For instructions, see the Problem Determination and Service
Guide.
Handling static-sensitive devices
Use this information to observe the static-sensitive device requirements.
Attention: Static electricity can damage the blade server and other electronic
devices. To avoid damage, keep static-sensitive devices in their static-protective
packages until you are ready to install them.
To reduce the possibility of damage from electrostatic discharge, observe the
following precautions:
v When you work on a BladeCenter unit that has an electrostatic discharge (ESD)
connector, use a wrist strap, especially when you handle modules, optional
devices, or blade servers. To work correctly, the wrist strap must have a good
contact at both ends (touching your skin at one end and firmly connected to the
ESD connector on the front or back of the BladeCenter unit).
v Limit your movement. Movement can cause static electricity to build up around
you.
v Handle the device carefully, holding it by its edges or its frame.
v Do not touch solder joints, pins, or exposed circuitry.
v Do not leave the device where others can handle and damage it.
v While the device is still in its static-protective package, touch it to an unpainted
metal part of the BladeCenter unit or any unpainted metal surface on any other
grounded rack component in the rack in which you are installing the device for
at least 2 seconds. This drains static electricity from the package and from your
body.
v Remove the device from its package and install it directly into the blade server
without setting down the device. If it is necessary to set down the device, put it
back into its static-protective package. Do not place the device on the blade
server cover or on a metal surface.
v Take additional care when you handle devices during cold weather. Heating
reduces indoor humidity and increases static electricity.
22 BladeCenter HS22 Type 7870 and 1936: Installation and User's Guide

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IBM BladeCenter HS22 Specifications

General IconGeneral
Tcase76.2 °C
Bus typeQPI
SteppingB1
FSB ParityNo
Processor codeSLBZ8
Processor cache12 MB
Processor cores6
Processor modelE5649
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5600 Series
Processor socketSocket B (LGA 1366)
Processor threads12
Processor codenameWestmere EP
Processor frequency2.53 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor package size42.5 X 45 mm
Processor front side bus1333 MHz
Processor boost frequency2.93 GHz
Processor operating modes64-bit
ECC supported by processorYes
Supported instruction setsSSE4.2
Thermal Design Power (TDP)80 W
Compatible processor seriesIntel® Xeon®
Number of processors installed1
CPU multiplier (bus/core ratio)19
Maximum number of SMP processors2
Physical Address Extension (PAE)40 bit
Memory types supported by processorDDR3 800/1066/1333
Memory channels supported by processorTriple
Memory bandwidth supported by processor (max)32 GB/s
Maximum internal memory supported by processor288 GB
HDD size2.5 \
RAID levels0, 1
HDD interfaceSerial Attached SCSI (SAS)
Total storage capacity0 GB
Maximum storage capacity1 TB
Number of HDDs installed0
Internal memory12 GB
Memory clock speed- MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory192 GB
Memory layout (slots x size)3 x 4 GB
Graphics cardG200eV
Graphics card memory typeGDDR2
Networking featuresGigabit Ethernet
PS/2 ports quantity-
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Compatible operating systemsMicrosoft Windows RedHat, SUSE, VMware Oracle Solaris
Chassis typeRack (1U)
Processor ARK ID52581
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Depth446 mm
Width245 mm
Height29 mm
Weight5400 g

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