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IBM BladeCenter HS22 User Manual

IBM BladeCenter HS22
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c. Align the three screws on the heat sink with the holes on the heat-sink
retention module.
d. Press firmly on the captive screws and tighten them with a screwdriver,
alternating among the screws until they are tight. If possible, each screw
should be rotated two full rotations at a time. Repeat until the screws are
tight. Do not overtighten the screws by using excessive force. If you are
using a torque wrench, tighten the screws to 8.5 Newton-meters (Nm) to
13 Nm (6.3 foot-pounds to 9.6 foot-pounds).
10. Reinstall the memory module or DIMM filler closest to the microprocessor
you installed.
a. If you installed microprocessor 1, install the memory module into DIMM
connector 1 (see “Installing a memory module” on page 29).
b. If you installed microprocessor 2, install the memory module into DIMM
connector 6 (see “Installing a memory module” on page 29).
11. If you are using a single microprocessor, make sure that memory modules are
installed in DIMM socket 2 and DIMM socket 6. If two microprocessors
installed in the blade server, make sure that memory modules are installed in
DIMM socket 2, DIMM socket 6, DIMM socket 8, and DIMM socket 12. See
“Installing a memory module” on page 29 for more information on installing a
memory module.
12. Install the optional expansion unit, if you removed one from the blade server
to replace the battery (see “Installing an optional expansion unit” on page 25
for instructions).
Thermal grease
Use this information to determine the guidelines for using thermal grease on a
heat sink and processor.
The thermal grease must be replaced whenever the heat sink has been removed
from the top of the microprocessor and is going to be reused or when debris is
found in the grease.
To replace damaged or contaminated thermal grease on the microprocessor and
heat sink, complete the following steps:
1. Place the heat-sink assembly on a clean work surface.
2. Remove the cleaning pad from its package and unfold it completely.
3. Use the cleaning pad to wipe the thermal grease from the bottom of the heat
sink.
Note: Make sure that all of the thermal grease is removed.
4. Use a clean area of the cleaning pad to wipe the thermal grease from the
microprocessor; then, dispose of the cleaning pad after all of the thermal grease
is removed.
Chapter 3. Installing options 37

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IBM BladeCenter HS22 Specifications

General IconGeneral
Tcase76.2 °C
Bus typeQPI
SteppingB1
FSB ParityNo
Processor codeSLBZ8
Processor cache12 MB
Processor cores6
Processor modelE5649
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5600 Series
Processor socketSocket B (LGA 1366)
Processor threads12
Processor codenameWestmere EP
Processor frequency2.53 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor package size42.5 X 45 mm
Processor front side bus1333 MHz
Processor boost frequency2.93 GHz
Processor operating modes64-bit
ECC supported by processorYes
Supported instruction setsSSE4.2
Thermal Design Power (TDP)80 W
Compatible processor seriesIntel® Xeon®
Number of processors installed1
CPU multiplier (bus/core ratio)19
Maximum number of SMP processors2
Physical Address Extension (PAE)40 bit
Memory types supported by processorDDR3 800/1066/1333
Memory channels supported by processorTriple
Memory bandwidth supported by processor (max)32 GB/s
Maximum internal memory supported by processor288 GB
HDD size2.5 \
RAID levels0, 1
HDD interfaceSerial Attached SCSI (SAS)
Total storage capacity0 GB
Maximum storage capacity1 TB
Number of HDDs installed0
Internal memory12 GB
Memory clock speed- MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory192 GB
Memory layout (slots x size)3 x 4 GB
Graphics cardG200eV
Graphics card memory typeGDDR2
Networking featuresGigabit Ethernet
PS/2 ports quantity-
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Compatible operating systemsMicrosoft Windows RedHat, SUSE, VMware Oracle Solaris
Chassis typeRack (1U)
Processor ARK ID52581
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Depth446 mm
Width245 mm
Height29 mm
Weight5400 g

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