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IBM BladeCenter HS22 User Manual

IBM BladeCenter HS22
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a. Make sure that the retaining clips are in the open position, away from the
center of the DIMM connector.
b. Turn the DIMM so that the DIMM keys align correctly with the DIMM
connector on the system board.
Attention: To avoid breaking the retaining clips or damaging the DIMM
connectors, handle the clips gently.
c. Press the DIMM into the DIMM connector. The retaining clips will lock the
DIMM into the connector.
d. Make sure that the small tabs on the retaining clips are in the notches on
the DIMM. If there is a gap between the DIMM and the retaining clips, the
DIMM has not been correctly installed. Press the DIMM firmly into the
connector, and then press the retaining clips toward the DIMM until the
tabs are fully seated. When the DIMM is correctly installed, the retaining
clips are parallel to the sides of the DIMM.
12. If the DIMM access door is open, use your fingers to close it.
13. If you have other devices to install or remove, do so now; otherwise, go to
“Completing the installation” on page 49.
Removing a memory module
Use this information to remove a memory module from the blade server.
The following illustration shows how to remove a DIMM from the blade server.
This information also applies to removing a DIMM filler.
Retaining
clip
DIMM
To remove a DIMM, complete the following steps.
1. Before you begin, read “Safety” on page v and “Installation guidelines” on
page 21.
2. If the blade server is installed in a BladeCenter unit, remove it (see “Removing
the blade server from the BladeCenter unit” on page 23).
3. Remove the blade server cover (see “Removing the blade server cover” on page
24).
4. If an optional expansion unit is installed, remove the expansion unit (see
“Removing an optional expansion unit” on page 26).
5. Locate the DIMM connectors (see “Blade server connectors” on page 19).
Determine which DIMM you want to remove from the blade server.
Attention: To avoid breaking the retaining clips or damaging the DIMM
connectors, handle the clips gently.
Chapter 3. Installing options 33

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IBM BladeCenter HS22 Specifications

General IconGeneral
Tcase76.2 °C
Bus typeQPI
SteppingB1
FSB ParityNo
Processor codeSLBZ8
Processor cache12 MB
Processor cores6
Processor modelE5649
System bus rate5.86 GT/s
Processor seriesIntel Xeon 5600 Series
Processor socketSocket B (LGA 1366)
Processor threads12
Processor codenameWestmere EP
Processor frequency2.53 GHz
Processor cache typeSmart Cache
Processor lithography32 nm
Processor manufacturerIntel
Processor package size42.5 X 45 mm
Processor front side bus1333 MHz
Processor boost frequency2.93 GHz
Processor operating modes64-bit
ECC supported by processorYes
Supported instruction setsSSE4.2
Thermal Design Power (TDP)80 W
Compatible processor seriesIntel® Xeon®
Number of processors installed1
CPU multiplier (bus/core ratio)19
Maximum number of SMP processors2
Physical Address Extension (PAE)40 bit
Memory types supported by processorDDR3 800/1066/1333
Memory channels supported by processorTriple
Memory bandwidth supported by processor (max)32 GB/s
Maximum internal memory supported by processor288 GB
HDD size2.5 \
RAID levels0, 1
HDD interfaceSerial Attached SCSI (SAS)
Total storage capacity0 GB
Maximum storage capacity1 TB
Number of HDDs installed0
Internal memory12 GB
Memory clock speed- MHz
Internal memory typeDDR3-SDRAM
Maximum internal memory192 GB
Memory layout (slots x size)3 x 4 GB
Graphics cardG200eV
Graphics card memory typeGDDR2
Networking featuresGigabit Ethernet
PS/2 ports quantity-
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Compatible operating systemsMicrosoft Windows RedHat, SUSE, VMware Oracle Solaris
Chassis typeRack (1U)
Processor ARK ID52581
Intel® Turbo Boost Technology1.0
Weight and Dimensions IconWeight and Dimensions
Depth446 mm
Width245 mm
Height29 mm
Weight5400 g

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