Q150T Sample Preparation System
10473 - Issue 5 80 Q150T - Instruction Manual
Table 26 Controlled Pulse cord
Name Default
Value
Minimum
Value
Maximum
Value
Comment
Terminate
thickness
5 0.5 30 Terminate the coating when the
FTM measured thickness
reaches this value
Pulse Resolution 0.4 0.2 2 Requested deposition on FTM
for each pulse. Note this should
be multiplied by the tooling
factor to find the expected stage
thickness for each pulse.
Current Step Rate 0.4 4 2 Set the amount the pulse current
is changed by if the deposited
thickness on the last pulse is not
with in 0.2nm of the pulse
Resolution
Pulse Current 54 0 70 Sets the starting pulse current
Max Pulse Voltage 11 9 16 Maximum voltage during the
pulse
Pulse Length
(Second)
1 0.02 10 Set the Pulse length in seconds
Maximum Pulses 25 1 50 Set the maximum number of
pulses to apply if the terminate
thickness is not being achieved
Pulse Interval 10 5 30 Set the length of time between
the pulses in seconds. Note
reducing this time will reduce the
time the FTM has to settle and
reduce accuracy
Out Gas Time 30 2 60 Time the cord is outgassed
Out Gas current 30 0 50 The current applied to the cord
during the outgas time
Max outgas
recovery time*
60 0 300 The maximum time the system
will wait for the vacuum to return
to the vacuum level it was at prior
to outgassing
Flush chamber* No Set to yes to flush the chamber
with the vent (N
2
) gas before
pumping down for the process
Pump hold Yes If yes, Q150T pumps down to an
outgas – ready state and waits
for user input.
Note: If the system waits longer
then the Pump hold time the
chamber will be vented. Pump
hold time can be found in
System | Vacuum
Tooling factor 2.25 0.1 10 The deposition on the FTM
crystal is multiplied by this value
before it is displayed. Thus
allowing it to be used to
compensated the FTM for a
different rate of deposition
between the FTM and the stage
*Admin group level required to edit this property
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