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HP ZBook 15u G5 User Manual

HP ZBook 15u G5
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Cable management
Proper routing of the internal cables is critical to the operation of the computer. Follow good cable
management practices when removing and installing components.
Handle cables with care to avoid damage.
Apply only the tension required to seat or unseat cables during insertion or removal from the connector.
When possible, handle cables by the connector or pull-strap.
Route cables in such a way that they cannot be caught or snagged by parts being removed or replaced.
Keep cables away from direct contact with major heat sources, such as the heat sink. (Some air ow
guides have a cable guide that lets you route cables safely around the heat sink.)
Do not jam cables on top of daughterboards or memory modules (DIMMs). Circuit cards and DIMMs are
not designed to take excessive pressure.
Keep cables clear of any movable or rotating parts (such as a fan) to prevent them from being cut or
crimped when the component is lowered into its normal position.
In all cases, avoid bending or twisting the cables. Do not bend any cable sharply. A sharp bend can break
the internal wires.
Do not rely on components like the keyboard or service door to push cables down internally. Always
position the cables to lay properly by themselves or in the cable guides and chassis areas designed for
cable routing.
CAUTION: Always release connector latch before removing the cable. Otherwise, pulling the cable could
damage the cable pins and result in a failed device.
Additional information 159

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HP ZBook 15u G5 Specifications

General IconGeneral
Form factorClamshell
Product typeMobile workstation
Product colorGray
Country of originChina
Panel typeUWVA
Touchscreen-
LED backlightYes
Display diagonal15.6 \
Native aspect ratio16:9
Memory slots2x SO-DIMM
Memory clock speed2400 MHz
Memory form factorSO-DIMM
Internal memory typeDDR4-SDRAM
Maximum internal memory32 GB
SSD capacityThe Solid State Drive's storage capacity in Gigabytes.
Storage mediaSSD
Total storage capacity512 GB
Compatible memory cardsSD, SDHC, SDXC
Number of SSDs installed1
Number of built-in speakers2
HP segmentBusiness
HP speaker typeHP Dual Speakers
Front camera HD typeHD
HDMI version1.4
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity0
Wi-Fi standards802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Top Wi-Fi standardWi-Fi 5 (802.11ac)
Ethernet LAN data rates10, 100, 1000 Mbit/s
Pointing deviceTouchpad
AC adapter power- W
On-board graphics card ID0x5917
On-board graphics card modelIntel® UHD Graphics 620
On-board graphics card familyIntel® UHD Graphics
On-board graphics card OpenGL version4.4
On-board graphics card base frequency300 MHz
On-board graphics card DirectX version12.0
On-board graphics card dynamic frequency (max)1150 MHz
Battery capacity56 Wh
Number of battery cells3
Bus typeOPI
SteppingY0
Tjunction100 °C
Processor cache8 MB
Processor cores4
System bus rate4 GT/s
Processor familyIntel® Core™ i7
Processor socketBGA 1356
Processor threads8
Processor codenameKaby Lake R
Configurable TDP-up25 W
Processor frequency1.9 GHz
Configurable TDP-down10 W
Processor lithography14 nm
Processor manufacturerIntel
PCI Express slots version3.0
Processor boost frequency4.2 GHz
Processor operating modes64-bit
PCI Express configurations1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)15 W
Configurable TDP-up frequency2.1 GHz
Configurable TDP-down frequency0.8 GHz
Maximum number of PCI Express lanes12
Processor codeSR3L8
Processor ARK ID124968
Processor package size42 x 24 mm
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version1.00
Weight and Dimensions IconWeight and Dimensions
Depth251 mm
Width370.8 mm
Height18.6 mm
Weight1770 g

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