Smart Module Series
SG368Z_Series_Hardware_Design 54 / 113
level difference between the headset GND. Route HPH_GND trace between HPH_R and HPH_L to
avoid interference from other signals.
4. HPH_R/HPH_L can be used for LINEOUT function to connect to an external power amplifier. In this
scenario, HPH_GND can be connected to ground at the module end.
4.8.3. Loudspeaker Interface Reference Design
EARP
EA
RN
SPK_P
SPK_M
NM
Module
D1 D2
NM
C1 C2
GND
Figure 16: Reference Design of Loudspeaker Interface
1. The headset and loudspeaker functions require an external 5 V power supply input, and the power
supply input pin is VCC_SPK_HP.
2. The module can provide a maximum driving capacity of 1.3 W @ 8 Ω (5 V power supply). If you need
to drive a higher-power speaker, it is recommended to add an power amplifier chip.
4.8.4. Audio Interfaces Design Considerations
The filter capacitor on the PCB should be placed near the audio device or audio interface as close as
possible, and the trace should be as short as possible. The filter capacitor should be passed before
reaching other connection points.
To decrease signal interferences, RF antennas should be placed away from audio interfaces and audio
traces. Power traces and audio traces should not be parallel, and they should be far away from each
other.
The differential audio traces must be routed according to the differential signal layout rule.
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