Star Micronics TUP500 series User Manual

TUP500 Series Product Specifications 3-22
3.7. Reliability Specifications
3.7.1. Thermal Mechanism Module
(1) Life: See table below.
• Mechanical Life: 20 million lines
• Thermal Head
<Printing Conditions> See the table below with average printing rate: 12.5% (Head average
resistance value change rate: Max. ±15%)
Manufacturer
Product
Name
Quality Characteristics and Use
Paper
Thickness
Head Life
(μm) Number
of Pulses
(100 Mil-
lion)
Distance
(km)
Mitsubishi Paper
Mills Limited
P220AG Normal Type 65 1.0 100
HP220A Long-storage Type 65 1.0 100
HP220AB-1 Long-storage Type 75 1.0 100
P220AGB Normal Type (For Cards and Tickets) 80 1.0 100
P220AB Normal Type (For Cards and Tickets) 85 1.0 50
PB670/
PB770
2-Color Type (Red/Black, Blue/Black) 75 0.5 50
Oji Paper Com-
pany
PD150R Normal Type 75 1.0 100
PD160R Long-storage Type 65/75 1.0 100
PD750R/
PD700R
2-Color Type (Red/Black, Blue/Black) 75 0.5 50
KSP P320RB/
P320BB
2-Color Type (Red/Black, Blue/Black) 65 0.5 50
Nippon Paper
Industries
TF50KS-
E2D
Normal Type 65 1.0 100
Notes:
1. Mechanical parts life is defined as the period at which failures from wear out is entered.
2. When two or more adjacent dots are damaged, that is considered to be the life of the head.
However, this excludes damage (scratches) caused by the adherence of foreign matter or
man-made damages.
3. When repeated printing under extremely high printing rates, the life of the thermal head
will notable decrease. Carefully consider your print format before printing.
4. The above reliability specifications are values when using the recommended thermal pa-
per. When using a different type of paper, reliability is not guaranteed.
• Auto-cutter
The table below shows cutter life when using the recommended thermal paper.
(Paper Width: 79.5 to 82.5 mm)
Paper Thickness Life
65 μm ≤ Paper Thickness ≤ 100 μm 1 Million Cuts
100 μm ≤ Paper Thickness ≤ 150 μm 300,000 Cuts
Note:
1. The contents above are values when using the recommended thermal paper.
When using a different type of paper, reliability is not guaranteed.
• Presenter Module
Number of receipt issues: 1 million receipts

Star Micronics TUP500 series Specifications

General

Brand	Star Micronics
Model	TUP500 series
Category	Printer
Language	English

Summary

1. GENERAL DESCRIPTION

How to Display the Model Name

Explains how to interpret the TUP500 model name structure.

2. CONFIGURATION

2.1. Basic Configuration and Descriptions of Modules

Describes the modular composition of the TUP500 printer.

2.2. Optional Parts Selectable for the Modules

Lists selectable options for printer modules.

3. BASIC SPECIFICATIONS

3.1. Print Specifications

Details printing method, dot configuration, density, and region.

3.2. Character Specifications and Bar Code Specifications

Details character and barcode specifications for STAR Line Mode.

3.3. Paper Specifications

Covers paper width, thickness, and external diameter specifications.

3.4. Thermal Mechanism Module

Details thermal head configuration, density, and voltage.

3.5. Presenter Module

Details presenter conveyance roller feed method and speed.

3.6. Roll Paper Supply Module

Details roll paper support, width adjustment, and paper tube specs.

3.7. Reliability Specifications

Covers mechanical, thermal head, and auto-cutter reliability.

4. EXTERNAL SPECIFICATIONS

4.1. External Specifications

Details external dimensions of printer units.

4.2. Operating Unit Specifications

Explains the function of the power and feed/cancel switches.

5. AMBIENT SPECIFICATIONS

5.1. Temperature and Humidity

Details operating and storage temperature/humidity ranges.

5.2. EMC (Electromagnet Compatibility)

Lists emission standards and limit values.

5.3. Vibration/Falling Shocks

Specifies vibration test conditions.

6. RELATED RULES

6.1. Compatible Specifications

Lists country-specific compatible standards.

7. USAGE EXAMPLE (LAYOUT EXAMPLE)

7.2. Layout of the Large Roll Paper Holder Unit (RUH-T500, Optional)

Explains layout considerations for the optional paper holder.

8. PRINTER SETUP

8.1. Mounting the Units

Instructions for mounting the printer and optional units.

8.2. Assembly of the Large Roll Paper Holder Unit (RUH-T500, Optional)

Step-by-step assembly for horizontal layout.

8.3. Fastening the Friction Spring

Instructions for fastening friction spring.

8.4. Adjusting the Near-end Sensor Unit

Method for adjusting sensor position for paper width.

9. HANDLING THE PRINTER UNIT

9.1. How to Set the Roll Paper

Step-by-step guide for loading roll paper.

9.2. Maintenance Method

Instructions for periodic cleaning of thermal mechanism and presenter.

9.4. Precautions for Handling

Important safety and handling precautions for the printer.

9.5. Precautions Concerning Safety

General safety precautions for printer operation and maintenance.

10. CIRCUIT GENERAL SPECIFICATIONS

10.1. General Specifications

Overview of interface, power, dimensions, and board components.

11. CIRCUIT CONFIGURATION

11.1. Block Diagram

Visual representation of the printer's circuit connections.

12. CIRCUIT CONNECTION SPECIFICATIONS

12.1. Connector Specifications and Signal Names

Details connectors and their signal assignments on the control PCB.

13. DIP SWITCH SPECIFICATIONS

13.1. Main Board DIPSW 1

Details DIP switch settings for various interfaces.

14. MSW SPECIFICATIONS

14.1. MSW 0

Specifies memory switch settings for destination and character modes.

14.2. MSW1

Specifies memory switch settings for top margin, fonts, and international characters.

14.3. MSW2

Specifies memory switch settings for print speed and density.

14.4. MSW3

Specifies memory switch settings for code pages and character positions.

14.5. MSW4

Specifies memory switch settings for print mode and region.

14.6. MSW5

Specifies memory switch settings for presenter auto-recovery and snout control.

14.7. MSW6

Specifies memory switch settings for auto-loading and presenter paper position.

14.8. MSW 7

Specifies memory switch settings for ASB functions.

14.9. MSW8

Specifies memory switch settings for loaded format on power-on.

14.11. MSWA

Specifies memory switch settings for NE sensor input.

15. OPERATING SPECIFICATIONS

15.1. Operating Specifications

Overview of printer operations via switches and LEDs.

15.2. LED Specifications

Details the meaning and behavior of system LEDs.

15.3. Error Specifications

Describes auto-recovery errors and their cancellation.

15.4. Sensor Adjustment Mode Specifications

Procedure to adjust PE/Black Mark sensor sensitivity.

16. COMMAND SPECIFICATIONS AND CHARACTER CODES

16.1. STAR Line Mode

Refers to separate document for STAR Line Mode command specs.