Dell PowerEdge R510 Technical Guidebook

Dell
PowerEdge R510 Technical Guide 10
2.1.2 Intel 5500 Chipset
Although the chipset supports up to 18 DIMMs, the PowerEdge R510 is designed with 8 DIMM slots. For more information
on the Intel 5500 chipset, see Section 8, Chipset.
2.1.3 PCIe Generation 2
PCIe Gen 2 provides the next generation of I/O bandwidth to the system. PCIe Gen2 doubles the signaling bit
rate of each lane from 2.5 Gb/s to 5 Gb/s.
2.1.4 DDR3 Memory Technology
Intel Xeon 5500 series processors support new DDR3 memory technology, which replaces fully buffered
DIMMs in the new Intel architecture. Native DDR3 memory capability improves memory access speed, lowers
latency, and allows more memory capacity.
2.1.5 Next Generation Dell Embedded Server Management
The chart below shows the components of the new embedded server management capability. The PowerEdge
R510 default server management is the Baseboard Management Controller (BMC). iDRAC6 Express and
iDRAC6 Enterprise are offered as upgrade options. The iDRAC Express hosts the Lifecycle Controller and
Unified Server Configurator. Optional iDRAC6 Express and iDRAC6 Enterprise provide out-of-band
management capabilities and enable the optional V-Flash.
Figure 2. Embedded Server Management Capability

Dell PowerEdge R510 Specifications

General

HDD size	3.5 \
Hot-swap	Yes
HDD capacity	450 GB
HDD interface	Serial Attached SCSI (SAS)
Total storage capacity	900 GB
Number of HDDs installed	2
Number of HDDs supported	8
Internal memory	4 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	64 GB
Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF6
Processor cache	8 MB
Processor cores	4
Processor model	E5540
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5500
Processing Die size	263 mm²
Processor frequency	2.53 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
Thermal Design Power (TDP)	80 W
CPU multiplier (bus/core ratio)	19
Number of Processing Die Transistors	731 M
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	144 GB
PS/2 ports quantity	0
Serial ports quantity	1
USB 2.0 ports quantity	6
Display	LCD
L1 cache	0.064 MB
Form factor	-
Graphics card	G200eW
Dimensions (WxDxH)	86.4 x 436.6 x 609.6 mm
Compatible operating systems	Microsoft Windows Small Business Server 2008/2003/ Novell SUSE Linux Enterprise Server 11/10 SP2 Linux Red Hat Enterprise 5.3/4.7 VMware vSphere Version 4.0 VMware ESX v3.5 / ESXi v3.5
Power consumption (typical)	1100 W
Noise level	42 dB
Chassis type	Rack (2U)
PCI Express x4 slots	3
Processor ARK ID	37104
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Weight	13500 g