Dell PowerEdge R510 Technical Guidebook

Dell
PowerEdge R510 Technical Guide 39
8 Chipset
8.1 Overview
The PowerEdge R510 motherboard incorporates the Intel 5500 chipset-24D IOH from Intel to perform memory
control, provide two QPI bus to two processors, and provide an ESI interface to the South Bridge chip. The
memory interface is optimized for 800/1066/1333 MHz DDR3 SDRAM memory with ECC when running with
Intel 5500 Chipset-EP processors.
8.2 Intel 5500 Chipset Features
The following high-level features are supported by Intel 5500 chipset:
• Package: FCBGA9
• Intel QuickPath interconnect: 2 ports
• ESI interface: x4 lanes
• Virtualization technology
• 24 PCIe Gen2 lanes
• Integrated Management Engine
• JTAG support
8.2.1 Intel QuickPath Interconnect
Intel QuickPath Interconnect features include:
• Point-to-point cache-coherent interconnect
• Fast/narrow unidirectional links
• Concurrent bi-directional traffic
• Error detection via CRC
• Error correction via Link level retry
• Intel Interconnect BIST (Intel IBIST) toolbox built-in
• Packet-based protocol
8.2.2 System Memory Interface
System memory interface features include:
• Memory controller integrated in CPU package
• 3 channels per processor (6 total)
• 3 DIMMs/channel supported (18 total)
• Max memory of 192-GB supported (At launch)
• Single Rank, Dual Rank, and Quad Rank DIMMs supported
• Support UDIMM and RDIMM
• DDR3 speeds of 800/1066/1333 supported
• 512 Mb, 1 Gb, 2 Gb, and 4 Gb Technologies/Densities supported
• No memory riser support

Dell PowerEdge R510 Specifications

General

HDD size	3.5 \
Hot-swap	Yes
HDD capacity	450 GB
HDD interface	Serial Attached SCSI (SAS)
Total storage capacity	900 GB
Number of HDDs installed	2
Number of HDDs supported	8
Internal memory	4 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	64 GB
Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF6
Processor cache	8 MB
Processor cores	4
Processor model	E5540
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5500
Processing Die size	263 mm²
Processor frequency	2.53 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
Thermal Design Power (TDP)	80 W
CPU multiplier (bus/core ratio)	19
Number of Processing Die Transistors	731 M
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	144 GB
PS/2 ports quantity	0
Serial ports quantity	1
USB 2.0 ports quantity	6
Display	LCD
L1 cache	0.064 MB
Form factor	-
Graphics card	G200eW
Dimensions (WxDxH)	86.4 x 436.6 x 609.6 mm
Compatible operating systems	Microsoft Windows Small Business Server 2008/2003/ Novell SUSE Linux Enterprise Server 11/10 SP2 Linux Red Hat Enterprise 5.3/4.7 VMware vSphere Version 4.0 VMware ESX v3.5 / ESXi v3.5
Power consumption (typical)	1100 W
Noise level	42 dB
Chassis type	Rack (2U)
PCI Express x4 slots	3
Processor ARK ID	37104
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Weight	13500 g