Dell PowerEdge R510 Technical Guidebook

Dell
71
Technical Guidebook’s Title
Table 34. Methodology for Memory Protection and Clearing
How is this memory write
protected? How is the memory cleared?
Planar
System BIOS SPI
Flash
Software write protected
Not possible with any utilities or applications and system is not
functional if corrupted/removed.
LOM Configuration
Data
Not explicitly protected but
special applications are
needed to communicate
through the LOMs to
reprogram this ROM. Not user-clearable
iDRAC6 Controller
ROM
protected permanently by
hardware Not clearable
iDRAC6 controller
RAM
n/a iDRAC reset
System CPLD
Requires special system
specific utility
Not possible with any utilities or applications and system is not
functional if corrupted/removed.
System CPLD Not accessible Not clearable
iDRAC6 Express
Internal Flash
Writes are proxied through
a temporary iDRAC
scratchpad RAM and not
directly made from an OS
or OS application. Not user-clearable
System RAM OS control Reboot or power down system
TPM ID EEPROM
(Plug in module only) HW read only Not - read only
TPM Binding
EEPROM (on China
planar only)
Locked by BIOS from
physical access by anyone
after boot N/A - BIOS control only
iDRAC6 SDRAM
n/a
AC cycle for BMC OS and reset / power off server for VGA frame
buffer
iDRAC6 FRU writes controlled by iDRAC
embedded OS EPPID is not clearable
iDRAC6 Boot Block
Flash iDRAC embedded OS
control of the write
protection.
Not possible with any utilities or applications and iDRAC does not
function as expected if corrupted/removed. Lifecycle log is
clearable only in a factory environment.
SEL is user-clearable
Trusted Platform
Module SW write protected F2 Setup option

Dell PowerEdge R510 Specifications

General

HDD size	3.5 \
Hot-swap	Yes
HDD capacity	450 GB
HDD interface	Serial Attached SCSI (SAS)
Total storage capacity	900 GB
Number of HDDs installed	2
Number of HDDs supported	8
Internal memory	4 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	64 GB
Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF6
Processor cache	8 MB
Processor cores	4
Processor model	E5540
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5500
Processing Die size	263 mm²
Processor frequency	2.53 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
Thermal Design Power (TDP)	80 W
CPU multiplier (bus/core ratio)	19
Number of Processing Die Transistors	731 M
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	144 GB
PS/2 ports quantity	0
Serial ports quantity	1
USB 2.0 ports quantity	6
Display	LCD
L1 cache	0.064 MB
Form factor	-
Graphics card	G200eW
Dimensions (WxDxH)	86.4 x 436.6 x 609.6 mm
Compatible operating systems	Microsoft Windows Small Business Server 2008/2003/ Novell SUSE Linux Enterprise Server 11/10 SP2 Linux Red Hat Enterprise 5.3/4.7 VMware vSphere Version 4.0 VMware ESX v3.5 / ESXi v3.5
Power consumption (typical)	1100 W
Noise level	42 dB
Chassis type	Rack (2U)
PCI Express x4 slots	3
Processor ARK ID	37104
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Weight	13500 g