Dell PowerEdge R510 Technical Guidebook

Dell
PowerEdge R510 Technical Guide 33
Figure 28. Connector (8 pins)
5.2 Thermal
Optimized thermal management makes PowerEdge R510 cool and quiet. Benefiting from a smart cooling
thermal control algorithm, the PowerEdge R510 can keep both high performance and good acoustics across a
wide range of ambient temperatures (10 °C – 35 °C). In addition, the PowerEdge R510 provides cooling
efficiency that saves energy.
The thermal design of the PowerEdge R510 reflects the following:
• Closed loop thermal control algorithm. Closed loop thermal control method uses feedback
temperatures to dynamically determine proper fan speeds.
• Comprehensive thermal management. The PowerEdge R510 controls system cooling fan speed
based on several different responses from critical components’ sensors, such as CPU temperature,
DIMM temperature, IOH temperature, inlet ambient temperature, and system configurations. The
thermal management adjusts cooling for the system according to the system’s needs.
• Optimized Ventilation. R510 chassis has a custom ventilation design which optimizes the air flow path.
Each component and peripheral receives sufficient air to cool.
5.3 Environmental Specifications
Table 9 details operating and storage requirements.
Pin
SIGNAL
Pin
SIGNAL
1
GND
5
P12V
A
2
GND
6
P12VA
3
GND
7
P12VB
4
GND
8
P12VB

Dell PowerEdge R510 Specifications

General

HDD size	3.5 \
Hot-swap	Yes
HDD capacity	450 GB
HDD interface	Serial Attached SCSI (SAS)
Total storage capacity	900 GB
Number of HDDs installed	2
Number of HDDs supported	8
Internal memory	4 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	64 GB
Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF6
Processor cache	8 MB
Processor cores	4
Processor model	E5540
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5500
Processing Die size	263 mm²
Processor frequency	2.53 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
Thermal Design Power (TDP)	80 W
CPU multiplier (bus/core ratio)	19
Number of Processing Die Transistors	731 M
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	144 GB
PS/2 ports quantity	0
Serial ports quantity	1
USB 2.0 ports quantity	6
Display	LCD
L1 cache	0.064 MB
Form factor	-
Graphics card	G200eW
Dimensions (WxDxH)	86.4 x 436.6 x 609.6 mm
Compatible operating systems	Microsoft Windows Small Business Server 2008/2003/ Novell SUSE Linux Enterprise Server 11/10 SP2 Linux Red Hat Enterprise 5.3/4.7 VMware vSphere Version 4.0 VMware ESX v3.5 / ESXi v3.5
Power consumption (typical)	1100 W
Noise level	42 dB
Chassis type	Rack (2U)
PCI Express x4 slots	3
Processor ARK ID	37104
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Weight	13500 g