Dell PowerEdge R510 Technical Guidebook

Dell
66
Technical Guidebook’s Title
Table 32. Volatility: Data Writing and Purpose
Can user programs or
operating system write data
to it during normal operation?
Purpose?
Planar
System BIOS SPI
Flash
No Boot Code, System Configuration Information, EUFI
environment
LOM Configuration
Data
No LAN on Motherboard configuration and firmware
iDRAC6 Controller
ROM
No not utilized
iDRAC6 controller
RAM
NO iDRAC internal RAM
System CPLD
No System specific Hardware Logic
System CPLD
No not utilized
iDRAC6 Express
Internal Flash
No for iDRAC Operating
System. Yes for Managed
System Services Repository
iDRAC Operating System plus Managed System
Services Repository (i.e., Unified Server Configurator, OS
drivers, diagnostics, and rollback versions of various
programs)
System RAM
Yes System OS RAM
TPM ID EEPROM
(Plug in module
only)
No BIOS Identification of TPM module
TPM Binding
EEPROM (China
only)
No BIOS binding of plug in module to a particular planar.
iDRAC6 SDRAM
No BMC OS + VGA frame buffer
iDRAC6 FRU
No motherboard electronic product identifier
iDRAC6 Boot Block
Flash
No iDRAC boot loader and configuration (i.e., MAC address),
Lifecycle log
nd system event log
Trusted Platform
Module
yes Storage of encryption keys
Chipset
CMOS
No BIOS settings

Dell PowerEdge R510 Specifications

General

HDD size	3.5 \
Hot-swap	Yes
HDD capacity	450 GB
HDD interface	Serial Attached SCSI (SAS)
Total storage capacity	900 GB
Number of HDDs installed	2
Number of HDDs supported	8
Internal memory	4 GB
Memory clock speed	1066 MHz
Internal memory type	DDR3-SDRAM
Maximum internal memory	64 GB
Tcase	76 °C
Bus type	QPI
Stepping	D0
FSB Parity	No
Processor code	SLBF6
Processor cache	8 MB
Processor cores	4
Processor model	E5540
System bus rate	5.86 GT/s
Processor series	Intel Xeon 5500 Series
Processor socket	Socket B (LGA 1366)
Processor codename	Nehalem EP
Motherboard chipset	Intel® 5500
Processing Die size	263 mm²
Processor frequency	2.53 GHz
Processor cache type	Smart Cache
Processor lithography	45 nm
Processor system type	DP
Processor manufacturer	Intel
Processor package size	42.5 x 45 mm
Processor front side bus	- MHz
Processor boost frequency	2.8 GHz
Processor operating modes	64-bit
Thermal Design Power (TDP)	80 W
CPU multiplier (bus/core ratio)	19
Number of Processing Die Transistors	731 M
Memory channels supported by processor	Triple
Memory clock speeds supported by processor	800, 1066 MHz
Memory bandwidth supported by processor (max)	25.6 GB/s
Maximum internal memory supported by processor	144 GB
PS/2 ports quantity	0
Serial ports quantity	1
USB 2.0 ports quantity	6
Display	LCD
L1 cache	0.064 MB
Form factor	-
Graphics card	G200eW
Dimensions (WxDxH)	86.4 x 436.6 x 609.6 mm
Compatible operating systems	Microsoft Windows Small Business Server 2008/2003/ Novell SUSE Linux Enterprise Server 11/10 SP2 Linux Red Hat Enterprise 5.3/4.7 VMware vSphere Version 4.0 VMware ESX v3.5 / ESXi v3.5
Power consumption (typical)	1100 W
Noise level	42 dB
Chassis type	Rack (2U)
PCI Express x4 slots	3
Processor ARK ID	37104
Intel® Turbo Boost Technology	1.0

Weight and Dimensions

Weight	13500 g