Intel® Server Board S1200V3RP TPS Environmental Limits Specification
Revision 1.2
12. Environmental Limits Specification
The following table defines the Intel
®
Server Board S1200V3RP series operating and non-
operating environmental limits. Operation of the Intel
®
Server Board S1200V3RP at conditions
beyond those shown in the following table may cause permanent damage to the system.
Exposure to absolute maximum rating conditions for extended periods may affect system
reliability.
Table 61. Server Board Design Specifications
0º C to 55º C 1 (32º F to 131º F)
Non-Operating Temperature
-40º C to 70º C (-40º F to 158º F)
± 5% of all nominal voltages
Trapezoidal, 35g, 170 inches/sec
Shock (Packaged)
< 20 pounds
20 to < 40 pounds
40 to < 80 pounds
80 to < 100 pounds
100 to < 120 pounds
120 pounds
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
5 Hz to 500 Hz 3.13 g RMS random
Note:
Intel Corporation server boards contain a number of high-density VLSI and power delivery components that need
adequate airflow to cool. Intel ensures through its own chassis development and testing that when Intel server
building blocks are used together, the fully integrated system will meet the intended thermal requirements of these
components. It is the responsibility of the system integrator who chooses not to use Intel developed server building
blocks to consult vendor datasheets and operating parameters to determine the amount of airflow required for their
specific application and environmental conditions. Intel Corporation cannot be held responsible, if components fail or
the server board does not operate correctly when used outside any of its published operating or non-operating limits.
Disclaimer Note: Intel ensures the unpackaged server board and system meet the shock
requirement mentioned above through its own chassis development and system configuration. It
is the responsibility of the system integrator to determine the proper shock level of the board
and system if the system integrator chooses different system configuration or different chassis.
Intel Corporation cannot be held responsible if components fail or the server board does not
operate correctly when used outside any of its published operating or non-operating limits.
12.1 Processor Thermal Design Power (TDP) Support
To allow optimal operation and long-term reliability of Intel
®
processor-based systems, the
processor must remain within the defined minimum and maximum case temperature (TCASE)
specifications. Thermal solutions not designed to provide sufficient thermal capability may affect
the long-term reliability of the processor and system. The server board is designed to support
the Intel
®
Xeon
®
Processor E3-1200 V3 product family TDP guidelines up to and including 95W.
Disclaimer Note: Intel Corporation server boards contain a number of high-density VLSI and
power delivery components that need adequate airflow to cool. Intel
®
ensures through its own
chassis development and testing that when Intel
®
server building blocks are used together, the
fully integrated system will meet the intended thermal requirements of these components. It is
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